WMSIC Electronic Components

WINBOND W634GU6QB-11 W634GU6QB

ModelW634GU6QB-11
PackageVFBGA-96
BrandWINBOND
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
WINBOND W634GU6QB-11
Type
VFBGA-96
Minimum package
1584 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WINBOND
Electronic Component
W634GU6QB-11
Electronic Component
1
Package
VFBGA-96
Electronic Component
DDR SDRAM
Electronic Component
3.04g
Electronic Component
1
Current
15mA
Electronic Component
BM0257505357
Electronic Component
4Gbit
Operating Temperature
0℃~+95℃
Operating Voltage
1.283V~1.45V
Operating Current
82mA
Clock Frequency(fc)
933MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

W634GU6QB-11 产品概述

一、产品简介

W634GU6QB-11 是 WINBOND(华邦)推出的一款低电压 DDR3L 动态随机存取存储器,存储密度为 4Gbit,内部组织为 x16。器件工作电压以 1.35V 为典型值,工作频率(fc)为 933 MHz(DDR 双倍数据率,对应 1866 MT/s 数据速率),适用于对带宽与功耗有平衡要求的嵌入式与消费类系统。

二、主要特性

  • 存储结构:SDRAM DDR3L,容量 4Gbit,x16 数据总线组织。
  • 时钟与性能:工作时钟 fc = 933 MHz(DDR 数据速率 1866 MT/s)。
  • 电源与功耗:工作电压范围 1.283V ~ 1.45V,典型 1.35V;工作电流约 82 mA,刷新电流约 15 mA。
  • 工作温度:0℃ ~ +95℃,适应高温环境要求较高的应用。
  • 封装:VFBGA-96,适合高密度板级封装与自动化组装。
  • 兼容 DDR3/DDR3L 时序与接口规范,便于与主流控制器配合。

三、典型应用

  • 网络与通信设备(路由器、交换机缓存)。
  • 嵌入式系统与工业控制(对宽温与长期稳定性要求较高)。
  • 多媒体设备与消费类电子(机顶盒、智能电视)。
  • 需要较大瞬时带宽且对功耗敏感的移动或便携系统。

四、关键电气与热性能

W634GU6QB-11 在 1.283V 至 1.45V 的电压范围内保证功能与时序稳定,典型工作电流 82 mA、刷新电流 15 mA,适合低电压设计以降低系统总体功耗。其 0℃ 至 +95℃ 的工作温度范围提示在 PCB 布局与散热设计时应考虑较高的温升裕量与可靠性验证。

五、设计注意事项

  • 电源完整性:为 VDD/VDDQ 提供低阻抗电源路径并在靠近引脚处布置充分的旁路电容。
  • 时钟与信号完整性:高速差分时钟与地址/命令线需做阻抗控制与匹配,缩短回流路径,避免串扰。
  • 退耦与热管理:BGA 封装应优化 PCB 的散热通道与底层铜皮,考虑焊盘下方的热通孔与多层散热结构。
  • 刷新与功耗管理:根据系统运行模式选择合适的刷新策略以平衡数据保持与功耗。
  • 兼容性:核对控制器对 DDR3L 时序支持,确认 VREF 与终端电阻配置满足器件要求。

六、封装与订购信息

  • 封装形式:VFBGA-96,适合自动化生产与高密度板级设计。
  • 型号:W634GU6QB-11(请在采购时核实完整的订单编码、速度等级与温度等级)。

七、总结

W634GU6QB-11 提供 4Gb 容量、x16 组织与 933 MHz 时钟性能,在低电压(1.35V)下兼顾带宽与能耗,适合需要高密度、低功耗且耐高温的嵌入式与网络应用。合理的 PCB 电源/信号布局与热设计对于发挥该器件的稳定性与长期可靠性至关重要。若需更详细的时序参数、引脚图或参考设计,请参考 WINBOND 官方数据手册或联系供应商获取技术支持。

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