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WeEn BTA225B-600B,118 BTA225B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- We En BTA225B-600B, 118
- Type
- WEEN
- Minimum package
- 800 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WEEN
- Electronic Component
- BTA225B-600B,118
- Electronic Component
- 1
- Package
- D2PAK
- Electronic Component
- Thyristor (SCR) / Module
- Electronic Component
- 1.74g
- Electronic Component
- 1
- Electronic Component
- BM0228692919
- Latching Current(Ih)
- 60mA
- Current(It)
- 25A
- Electronic Component
- Electronic Component
- Electronic Component
- 800
- Gate Current(Igt)
- 50mA
- Voltage(Vdrm)
- 600V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BTA225B-600B,118 产品概述
一、产品简介
BTA225B-600B,118 为 WeEn（瑞能）出品的标准型三端双向可控硅（TRIAC），采用表面贴装 D2PAK 封装，设计用于交流电路中的功率开关与相位控制。器件在600V耐压等级上提供坚实的静态阻断能力，同时支持高达25A的通态电流，适合中等功率的照明和电机控制方案。
二、主要参数
- 断态峰值电压（Vdrm）：600V
- 通态电流（It）：25A（额定通态电流，具体能力取决于散热条件）
- 门极触发电流（Igt）：50mA（典型门极驱动要求）
- 保持电流（Ih）：60mA
- 封装：D2PAK（表面贴装）
三、特性与优势
- 高耐压设计：600V 的断态电压可满足常见220VAC及更高工况下的安全裕度。
- 低门极驱动要求：Igt ≈50mA，便于与低功率驱动电路直接配合。
- 可靠通态能力：25A 的通态电流适合中功率负载，结合良好散热可实现稳定工作。
- D2PAK 表面贴装：利于高速SMT生产并可结合散热片或铜箔进行热管理，适合批量装配的现代化工艺。
四、典型应用
- 阶段性调光/相位切割的照明调节器（家居与舞台灯光）
- 小功率交流电机调速（风机、泵类）
- 固态继电器（SSR）模块与交流开关元件
- 加热器、温控设备的功率控制单元
五、封装与热管理
D2PAK 为扁平功率封装，便于铺铜与焊盘热扩散。器件的持续导通能力强烈依赖PCB散热设计：建议大面积散热铜箔、过孔连接底层散热层，必要时配合金属散热片或导热胶。实际允许的持续电流需根据环境温度与热阻进行退载设计。
六、使用与注意事项
- 门极驱动：确保驱动电流≥Igt，且在噪声环境下考虑适当的门极去抖与限流。
- 感性负载：对电感性负载应并联合适的RC缓冲或MOV抑制以防过压。
- 触发与退相：注意保持电流 Ih，确保在低电流工况下能稳定维持导通或断开。
- 焊接与ESD：遵循D2PAK的焊接规范与静电防护措施，避免热应力损伤。
七、订购信息
型号：BTA225B-600B,118；品牌：WeEn（瑞能）；封装：D2PAK。采购时请确认完整型号与批次，必要时索取数据手册与样品进行可靠性验证。
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