Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
WeEn BYV32E-300PQ BYV32E
Configuration
1 options
Configuration
Electronic Component
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- We En BYV32E-300PQ
- Type
- WEEN
- Unit
- Electronic Component
- Minimum package
- 1000 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- WEEN
- Electronic Component
- BYV32E-300PQ
- Electronic Component
- 1
- Package
- TO-220
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 2.617g
- Electronic Component
- 1
- Electronic Component
- BM0214312682
- Current
- 10A
- Diode
- 1
- Current(Ir)
- 20uA@300V
- (Vf)
- 1.25V@10A
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BYV32E-300PQ 产品概述
一、产品简介
BYV32E-300PQ 是由WeEn Semiconductors制造的一款高性能快恢复二极管，关键参数包括：标准的1对共阴极二极管配置，平均整流电流达10A，最大反向电压可达300V。这款二极管采用TO-220-3封装，方便通过通孔进行安装，广泛应用于各类电子电源和整流电路中。
二、主要特性
电流和电压特性：
- 平均整流电流（Io）：10A，适合用于中高功率的整流应用。
- 最大反向电压（Vr）：300V，能够承受较高的工作环境和尖峰电压。
快速恢复性能：
- 反向恢复时间（trr）：35ns，这意味着在交流电源切换时，该二极管能高效地恢复，从而减少反向恢复损耗，提升电源效率。
- 快速恢复特性：满足快速恢复 <= 500ns，> 200mA（Io），适合在高频开关电源和逆变器等应用场合中使用。
正向特性：
- 正向电压（Vf）：在10A的条件下，正向压降为1.25V，这在一定程度上影响了二极管的功耗和效率。
- 反向泄漏电流：在300V反向电压下，反向泄漏电流仅为20µA，显示了该二极管的优秀性能。
工作温度：
- 结合其结温能力，该二极管的最大工作温度高达175°C，适合在高温环境下维持长时间的运行，极大地拓宽了其应用范围。
封装和安装：
- 所采用的TO-220封装确保了良好的热管理性能，并且其通孔安装设计使得产品在PCB上的安装和更换非常方便。这一设计也使得它适合于各种散热器和冷却方案。
三、应用领域
BYV32E-300PQ二极管因其优秀的绝缘能力、快速恢复特性以及高整流效率，广泛应用于以下领域：
开关电源：
- 在现代的开关电源中，快速恢复二极管能够提升电源的整体性能和效率，这是由于其低的正向压降和短的反向恢复时间。
逆变器：
- 本产品可作为逆变器中的关键元件，通过确保高效的电流整流和低损耗运行，提升逆变器的输出效能。
电源模块：
- 采用BYV32E-300PQ的电源模块特别适合需要高可靠性的工业应用，能够在恶劣条件下稳定工作。
电动机驱动：
- 在一些电动机驱动电路中，能够有效进行整流并确保高性能的运行，进而提升电机的效率和稳定性。
四、总结
总的来说，BYV32E-300PQ 快恢复二极管是一个兼具高性能与多样化应用的产品，其快速恢复时间，良好的电流和电压特性，让其在电源管理和电力转换中成为不可或缺的元件。WeEn Semiconductors致力于通过持续创新和改进，不断提升其器件的性能，以满足广泛市场对高效率、高可靠性电子元件的需求。在选择整流二极管时，BYV32E-300PQ无疑是一个理想的选项，为电源物业、安全和稳定性提供保障。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
