WMSIC Electronic Components

WeEn Z0109NN0,135 Z0109NN0

ModelZ0109NN0,135
PackageSOT-223
BrandWEEN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 20+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
We En Z0109NN0, 135
Type
WEEN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
WEEN
Electronic Component
Z0109NN0,135
Electronic Component
1
Package
SOT-223
Electronic Component
Thyristor (SCR) / Module
Electronic Component
0.193g
Electronic Component
1
Electronic Component
BM0214790451
Latching Current(Ih)
10mA
Current(It)
1A
Electronic Component
Electronic Component
Electronic Component
4000
Gate Voltage(Vgt)
1.3V
Gate Current(Igt)
10mA
Voltage(Vdrm)
800V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:Z0109NN0,135 晶闸管(可控硅)

1. 概述
Z0109NN0,135 是一款高性能的双向可控硅,专为需要高电压和高温工作的应用场景而设计。此产品由瑞能(WeEn)公司生产,封装采用 SOT-223,具有优良的散热性能和适合表面贴装(SMD)的特性。本产品适配于电力电子应用中,旨在提供高效、可靠的开关性能。

2. 基本参数

  • 电流 - 通态(最大值): 1A
  • 工作温度: 最高可达 125°C(TJ)
  • 电流 - 栅极触发(最大值): 10mA
  • 电压 - 栅极触发(最大值): 1.3V
  • 电流 - 非重复浪涌 50/60Hz: 12.5A(50Hz)/ 13.8A(60Hz)
  • 电压 - 断态: 800V
  • 双向可控硅类型: 逻辑 - 灵敏栅极
  • 电流 - 保持(最大值): 10mA
  • 配置: 单路

3. 应用场景
Z0109NN0,135可广泛应用于工业控制、家电、电机驱动、温控设备以及电气开关等多种领域。其高电压(800V)和高非重复浪涌电流(至 13.8A)使得该元器件非常适合在高冲击电流条件下的电源管理和负载控制场景。

4. 性能特点

  • 高灵敏度触发: 该可控硅具有很低的触发电流和电压需求,使其在设计中更加灵活,能够与多种控制电路兼容。
  • 高温工作能力: 具备卓越的耐高温性能(125°C),适合在高温环境下操作。
  • 模块集成度高: SOT-223封装适合现代贴片技术,便于在电路板上实现高密度安装,节省空间并提高散热性能。
  • 双向控制能力: 可用于正向和反向电流的控制,为电路设计提供了更多的灵活性。

5. 设计考虑
在设计使用 Z0109NN0,135 的电路时,需要考虑其最大通态电流、栅极触发电流及电压、以及工作环境温度等参数。确保合理的散热设计以避免超出工作温度限制,必要时可考虑增加散热器。

6. 竞争优势
与市场上同类产品相比,Z0109NN0,135 以其优越的电气性能和尺寸优势,为用户提供了更高的集成度及更好的可靠性。适合瞬态条件下的应用,能够更好地适应各种工业和家电产品的需求。

综上所述,Z0109NN0,135 是一款适用于各种高电压电路的高灵敏度可控硅,凭借其出色的参数和特点,能在严苛的工作环境中发挥良好性能,是电力和电子行业中不可或缺的元器件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.