Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
worldsemi WS2812B-2020-V6 WS2812B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
15
specifications
Core information
- Product name
- worldsemi WS2812B-2020-V6
- Type
- WORLDSEMI
- Minimum package
- 4500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- WORLDSEMI
- Electronic Component
- WS2812B-2020-V6
- Electronic Component
- 1
- Package
- SMD2020-4P
- Electronic Component
- RGB LED(Built-in IC)
- Electronic Component
- 0.054g
- Electronic Component
- 1
- Features
- Built-in positions; Integrated; Built-in positions
- Electronic Component
- BM0264778361
- Electronic Component
- Electronic Component
- Electronic Component
- 4500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WS2812B-2020-V6 产品概述
一、产品简介
WS2812B-2020-V6 是 worldsemi 推出的超小型一体化智能全彩 LED 器件，采用 SMD2020-4P 封装（2.0×2.0mm，四引脚）。内部集成驱动电路与 RGB 发光单元，支持单线串联控制，便于高密度点阵与狭小空间的照明设计。器件在保持丰富色彩与高亮度的同时，针对工程实用场景增加了上电复位、掉电复位与智能反向连接保护功能，提高系统可靠性与抗误接能力。
二、主要特性
- 内置上电复位电路，保证上电瞬态稳定，防止花屏或数据错位。
- 集成掉电复位电路，断电或欠压恢复时自动清除错误状态。
- 智能反向连接保护，避免因电源接反造成器件损坏（仍建议避免长期反接）。
- 一体化恒流驱动，8-bit PWM 色深，24-bit（GRB 顺序）色彩控制，颜色平滑可控。
- 单线串行数据接口，支持串联级联控制，便于点阵与条形灯方案设计。
- 极小封装适配高密度 PCB 布局与可穿戴、微型显示等应用。
三、电气与引脚说明
- 典型工作电压以 5V 为主（具体允许范围请参照最新规格书）；供电与信号的兼容性需在设计时确认。
- 输出恒流控制，单颗在满白时典型电流可达几十毫安级，总线电流需按串联数量评估供电能力与散热。
- 四引脚功能一般包含：VDD（电源）、GND（接地）、DIN（数据输入）、DOUT（数据输出）。请以实际封装标注为准。
四、外形与封装
- SMD2020-4P 小型表贴封装，适合高像素密度应用。
- 建议参考封装尺寸与焊盘推荐图进行 PCB 设计，保证贴装可靠性与良好散热路径。
五、PCB 设计与焊接建议
- 在每颗器件的 VDD 与 GND 之间靠近放置去耦电容（如 0.1µF），减小电源瞬态影响。
- 数据线建议在输入端串联小阻（如 200–470 Ω）以抑制反射与 ringing，微控制器为 3.3V 输出时建议采用电平转换以确保稳定识别。
- 焊接工艺按无铅回流工艺处理，参考厂家回流温度曲线，避免超温或过长加热时间。
- 贴片、回流与输送过程中注意防静电与防潮处理，开封后按规定回流焊或在规定时间内使用。
六、典型应用场景
- 可穿戴灯饰、微型显示屏、智能手环与小尺寸装饰灯。
- 高密度像素点阵、树莓派/微控制器小型项目及背光补光场景。
- 室内装饰、舞台小型灯效与创意照明模块。
七、注意事项与工程建议
- 尽管器件带有反向连接保护，仍建议在电源设计中加入反向保护与保险措施以提高系统安全。
- 大规模并联或串联应用时需评估总电流与 PCB 热管理，必要时增加电源补强与散热机制。
- 量产前建议根据目标应用做完整的电磁兼容、寿命和温升测试，并依据 worldsemi 最新技术资料做最终设计确认。
如需更详细的电气参数、时序图或封装尺寸图纸，请查阅 worldsemi 官方规格书或联系供应商获取原厂资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
