WMSIC Electronic Components

XFCN PZ254V-11-02P PZ254V

ModelPZ254V-11-02P
PackageTHT,P=2.54MM
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN PZ254V-11-02P
Type
THT, P=2.54MM
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
PZ254V-11-02P
Electronic Component
2.5mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Pin Header
Electronic Component
0.12g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0259581200
Electronic Component
Through-hole
Operating Temperature
40℃~+105℃
PIN
2P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PZ254V-11-02P 产品概述

一、产品简介

PZ254V-11-02P 是 XFCN(兴飞)出品的一款 1x2P 直插排针,典型间距为 2.54mm(P=2.54mm),采用方针设计并为单排插件结构。整体外观为黑色塑料座配黄铜触头,适用于通孔 PCB 的连接、跳线和测试治具等场合。其外形紧凑、安装便捷,是通用电子连接器件库中的标准型号。

二、主要参数

  • 排针结构:1 x 2P(单排,2 针)
  • 间距(Pitch):2.54 mm
  • 针型:方针(方形针脚)
  • 安装方式:直插(通孔插装)
  • 总 PIN 位数:2P
  • 配合针长度:6 mm
  • 端接针长度:3 mm
  • 塑高(塑料座高度):2.5 mm
  • 触头材质:黄铜
  • 工作温度范围:-40 ℃ ~ +105 ℃
  • 颜色:黑色
  • 品牌:XFCN(兴飞)
  • 封装形式:插件,P=2.54mm

三、结构与材料特点

本型号采用黄铜触头,具有良好的机械强度和导电性能,利于后续电镀处理(视客户需求可选不同表面处理工艺)。方形针脚增加了与焊锡和 PCB 孔壁的接触面积,提升机械固定与电气可靠性。2.5mm 的低塑高设计有利于在低矮空间内实现可靠连接,同时便于与常见的插拔式连接体兼容。

四、典型应用场景

  • PCB 间或模块间点对点信号连接
  • 开发板、评估板与跳线座连接
  • 测试夹具与校准设备端子
  • 消费电子、工业控制、嵌入式系统等需要标准 2.54mm 排针的场合

五、安装与焊接建议

  • 适用通孔插件工艺,支持手工焊接与波峰焊(具体焊接参数请依据 PCB 材料和焊料规范设定,避免长时间高温暴露)。
  • 通孔尺寸应根据方针截面与电镀层厚度确定,常见设计建议参考 φ0.8mm 左右,最终以实际针径与公差为准。
  • 推荐在设计 PCB 时为排针预留合适的 Solder fillet 区域与机械加固孔,以提高抗拔插和振动能力。

六、包装与订购

产品常见以散装或托盘方式包装,便于批量采购与生产线使用。订购时请注明型号 PZ254V-11-02P、数量与如有的表面处理或特殊包装要求,以确保交付符合生产需求。

七、注意事项

  • 在选型时确认工作温度范围、所需电镀类型及机械强度是否满足使用环境;如有潮湿、盐雾或高温测试环境,建议与供应商确认表面处理与长期可靠性。
  • 若用于高频或大电流应用,请在系统级进行电气评估并与供应商沟通额定参数。
  • 安装时避免弯折针脚导致塑座应力集中或针脚损伤,焊接过程注意热量控制以免塑座变形。

如需 3D 尺寸图、PCB 封装文件(footprint)或批量采购报价,可提供具体需求,我可协助进一步确认与匹配建议。

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