WMSIC Electronic Components

XFCN M2501RF-03P M2501RF

ModelM2501RF-03P
PackageTHT-RA,P=2.5MM
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M2501RF-03P
Type
THT-RA, P=2.5MM
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
M2501RF-03P
Electronic Component
1
Package
P=2.5mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.357g
Electronic Component
2.5mm
PIN
3P
Electronic Component
1
Electronic Component
BM0265157493
Electronic Component
PA66
Electronic Component
Electronic Component
Pin
1x3P
PIN
3

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M2501RF-03P 线对板针座产品概述

M2501RF-03P是XFCN(兴飞)品牌推出的1x3P弯插式线对板针座,采用2.5mm行业标准间距设计,专为电气设备内部线束与PCB板的可靠连接开发,兼具电气性能稳定、防护安全、安装适配性强等特点,广泛适用于家电、工业控制等领域。

一、产品核心定位与基本属性

该针座属于线对板连接组件,核心功能是实现外部线束与PCB板的信号/电力传输;基础属性明确:

  • 封装类型:插件式(弯插),节省PCB板正面空间;
  • 针脚规格:1排×3PIN(总3P),满足多线连接需求;
  • 间距标准:2.5mm,符合行业通用规格,兼容性好;
  • 品牌与型号:XFCN兴飞,型号中“03P”对应3PIN、弯插结构适配紧凑布局。

二、关键技术参数解析

2.1 电气连接性能

  • 触头材质:黄铜(CuZn合金),兼具良好导电性(电阻率低)、耐磨性(多次插拔不易磨损);
  • 触头镀层:锡(Sn),镀层厚度符合行业标准,可有效防止触头氧化,降低接触电阻(典型接触电阻≤10mΩ),提升长期连接可靠性;
  • 额定参数:结合同规格产品推测,额定电流≤3A/针,额定电压≤250V(AC/DC),满足小功率设备连接需求。

2.2 结构与尺寸规格

  • 安装方式:弯插(直角插),针脚垂直于塑料基座,焊接后线束可平行于PCB板,节省垂直空间;
  • 关键尺寸:
    • Z轴(板上高度):5.8mm,焊接后针座顶部到PCB板的距离;
    • Y轴(底边宽度):7mm,基座底部横向宽度,适配常规PCB板布局;
  • 塑料基座:一体化注塑成型,结构稳定,防止针脚错位。

2.3 绝缘与防护性能

  • 塑料材质:PA66(聚酰胺66),耐温范围宽(连续工作温度-40℃~120℃,短期耐温可达180℃),耐油、耐弱酸弱碱,适合复杂环境;
  • 阻燃等级:UL94V-0,最高等级阻燃(无滴落、燃烧时间短),符合UL安全标准,降低设备起火风险。

三、典型应用场景

M2501RF-03P因性能适配性强,广泛应用于以下场景:

  1. 家用电器:冰箱、洗衣机、空调的控制板与线束连接(如温度传感器、电机控制线),PA66耐温性与V0阻燃满足家电安全要求;
  2. 工业控制设备:PLC模块、小型传感器、低压电机的接线(如自动化生产线信号传输),弯插设计适配设备内部紧凑空间;
  3. 消费电子:小型打印机、智能家居网关的内部连接(如Wi-Fi模块与电源板),2.5mm间距兼容性好;
  4. 车载辅助设备:车载充电器、行车记录仪的内部线束连接(PA66耐温性可满足常规车载环境)。

四、产品核心优势

  1. 电气可靠性高:黄铜触头+锡镀层组合,接触电阻稳定,多次插拔(≥500次)后仍保持良好连接;
  2. 安全防护性强:UL94V-0阻燃+PA66绝缘,有效防止短路起火,降低设备故障风险;
  3. 安装适配性好:2.5mm标准间距适配多数线束端子,弯插设计节省PCB空间,插件焊接牢固;
  4. 耐环境性能优:PA66材质耐温、耐油,适合厨房家电(油污)、工业车间(粉尘)等复杂环境。

五、安装与使用注意事项

  1. 安装前检查:确认针座无变形、触头无氧化,PCB焊盘间距与尺寸匹配;
  2. 焊接要求:焊接温度控制在260℃±10℃,单个针脚焊接时间≤3秒,避免高温损坏PA66基座;
  3. 插拔规范:插拔线束时避免过度弯折,防止针脚断裂;禁止带电插拔(需确认场景是否允许);
  4. 环境限制:避免长期暴露在超过120℃的高温环境,或强酸强碱等强腐蚀环境,以免影响塑料与触头性能。

M2501RF-03P凭借稳定的性能与广泛的适配性,成为中低端电气设备内部连接的常用选择,可满足多数常规场景的线对板连接需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.