WMSIC Electronic Components

XFCN M2029V-02-N0 M2029V

ModelM2029V-02-N0
PackageTHT,P=2MM
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 178115

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN M2029V-02-N0
Type
THT, P=2MM
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
M2029V-02-N0
Electronic Component
1
Package
Through-hole, P=2mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.165g
Electronic Component
2mm
PIN
2P
Electronic Component
1
Electronic Component
BM0265793444
Electronic Component
PA
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃
Pin
1x2P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

M2029V-02-N0 线对板针座产品概述

M2029V-02-N0是XFCN(兴飞)推出的一款直插式线对板针座,针对小型电子设备的紧凑连接需求设计,核心规格为1排2PIN、2mm间距,兼具稳定性能与通用兼容性,以下从多维度详细说明。

一、产品基本信息

该针座的核心参数清晰适配低引脚数连接场景:

  • 规格基础:1排2PIN(1×2P)设计,间距2mm(行业通用小间距),总PIN数2,满足双路信号/电源传输需求;
  • 安装方式:直插式插件封装,适配传统PCB焊接工艺,无需特殊工装即可完成手工或自动化焊接;
  • 尺寸参数:板上Z轴高度7.7mm,底边Y轴宽度5.3mm,紧凑尺寸不占用过多PCB空间,适合小型化设备布局。

二、关键性能与材料特性

产品性能依赖稳定的材料选型与工艺设计:

  • 触头性能:触头采用磷青铜材质,兼具良好导电性、耐磨性与弹性,插拔过程中接触力稳定,避免松动或接触不良;额定电流3A、额定电压250V,可覆盖常规电子设备的电源/信号传输需求;
  • 塑料主体:外壳采用PA(聚酰胺)材质,耐温范围-25℃~+85℃,适应不同环境温度变化(如北方低温或设备工作发热场景);同时具备UL94V-0阻燃等级,遇火后快速自熄,降低设备起火风险,符合安全规范。

三、安装与适配场景

该针座的设计适配多种实际应用场景:

  • 安装便捷性:直插式设计无需复杂操作,焊接后与PCB贴合紧密,可通过标准焊接设备实现批量生产;
  • 典型应用场景:
    1. 消费电子:智能插座、加湿器控制板、蓝牙音箱等小型设备的内部线路连接;
    2. 工业控制:小型传感器模块、微型MCU(单片机)的信号/电源接口;
    3. 智能家居:智能门锁、灯光控制器的内部模块连接,适配紧凑的产品结构。

四、合规与可靠性验证

产品通过多项基础验证,保障长期使用可靠性:

  • 安全合规:符合UL94V-0阻燃标准,满足电子设备的防火要求;
  • 环境适应性:经高低温循环测试,在-25℃低温(如户外设备低温启动)和+85℃高温(设备连续工作发热)环境下性能稳定;
  • 接触可靠性:磷青铜触头经抗氧化处理,长期使用不易出现氧化层,插拔寿命满足常规电子设备的使用周期需求。

五、品牌与封装优势

XFCN(兴飞)作为连接器领域的成熟品牌,该产品具备以下优势:

  • 通用兼容性:2mm间距封装属于行业通用规格,可与同类线对板连接器(如2P公端连接器)直接适配,便于客户选型替换;
  • 性价比优势:成熟工艺降低生产成本,同时保证性能稳定,适合中小批量电子设备的成本控制需求;
  • 工艺成熟度:品牌在连接器领域的生产经验,确保产品一致性与良品率。

综上,M2029V-02-N0凭借紧凑尺寸、稳定性能、通用兼容性,成为小型电子设备线对板连接的高性价比选型,可满足多种场景下的信号/电源传输需求。

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