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BH200R-10P是兴飞(XFCN)品牌推出的IDC刺破式简牛座,针对小间距、快速连接场景优化,属于工业级与消费电子通用型连接器。核心参数明确:间距2mm,双排5Pin(共10Pin)设计,采用弯插(弯针)安装方式,触头镀层为金,适配2mm间距IDC排线的快速连接需求。该产品兼顾可靠性与安装效率,可满足设备内部密集排线的连接要求。
采用2×5P双排针脚布局,严格遵循2mm国际通用间距标准,针脚排列整齐、间距均匀,可与同规格IDC排线精准匹配,避免错位连接风险。针脚通过高精度冲压工艺成型,尺寸一致性误差≤0.05mm,确保接触稳定性。
设计为弯针(90°弯折)结构,针脚垂直于连接器主体后弯折,适配PCB板侧面或紧凑空间布局——相比直插连接器,可节省PCB板垂直方向30%以上的安装空间,适合小型控制器、便携式设备等内部结构。
触头表面采用0.8μm厚金镀层(行业常规工业级标准),金镀层具备三大优势:①耐氧化,长期使用无接触电阻上升问题;②抗腐蚀,可适应湿度≤85%或轻微盐雾环境;③低接触电阻,减少信号传输损耗。
采用绝缘位移连接(IDC)技术,无需焊接即可实现排线与连接器的连接:排线插入时,针脚直接刺破排线绝缘层(适配0.12mm~0.15mm绝缘厚度),与内部导体紧密咬合。该工艺安装时间比焊接缩短60%,适合批量生产,且避免虚焊、热损伤等焊接缺陷。
BH200R-10P的设计特性使其适配多种电子设备的内部连接需求:
基于行业标准与实际测试,核心性能参数如下(供参考):
该产品以高可靠性、快速安装为核心优势,可有效降低设备内部连接的成本与故障率,是中小间距连接场景的优选方案。
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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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