WMSIC Electronic Components

XFCN BH200R-10P BH200R

ModelBH200R-10P
PackageTHT-RA,P=2MM
BrandXFCN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XFCN BH200R-10P
Type
THT-RA, P=2MM
Minimum package
240 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XFCN
Electronic Component
BH200R-10P
Electronic Component
1
Package
P=2mm
Electronic Component
2
Electronic Component
IDCInsulation Displacement Connector(Box Header / Box Header)
Electronic Component
2x5P
Electronic Component
2mm
Electronic Component
0.852g
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265157308
Electronic Component
Electronic Component
Operating Temperature
40℃~+105℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BH200R-10P 简牛座产品概述

一、产品核心定位与基本属性

BH200R-10P是兴飞(XFCN)品牌推出的IDC刺破式简牛座,针对小间距、快速连接场景优化,属于工业级与消费电子通用型连接器。核心参数明确:间距2mm,双排5Pin(共10Pin)设计,采用弯插(弯针)安装方式,触头镀层为金,适配2mm间距IDC排线的快速连接需求。该产品兼顾可靠性与安装效率,可满足设备内部密集排线的连接要求。

二、结构设计与工艺特点

1. 针脚布局与间距规范

采用2×5P双排针脚布局,严格遵循2mm国际通用间距标准,针脚排列整齐、间距均匀,可与同规格IDC排线精准匹配,避免错位连接风险。针脚通过高精度冲压工艺成型,尺寸一致性误差≤0.05mm,确保接触稳定性。

2. 弯插安装方式

设计为弯针(90°弯折)结构,针脚垂直于连接器主体后弯折,适配PCB板侧面或紧凑空间布局——相比直插连接器,可节省PCB板垂直方向30%以上的安装空间,适合小型控制器、便携式设备等内部结构。

3. 金镀层触头

触头表面采用0.8μm厚金镀层(行业常规工业级标准),金镀层具备三大优势:①耐氧化,长期使用无接触电阻上升问题;②抗腐蚀,可适应湿度≤85%或轻微盐雾环境;③低接触电阻,减少信号传输损耗。

4. IDC刺破连接结构

采用绝缘位移连接(IDC)技术,无需焊接即可实现排线与连接器的连接:排线插入时,针脚直接刺破排线绝缘层(适配0.12mm~0.15mm绝缘厚度),与内部导体紧密咬合。该工艺安装时间比焊接缩短60%,适合批量生产,且避免虚焊、热损伤等焊接缺陷。

三、应用场景与适配性

BH200R-10P的设计特性使其适配多种电子设备的内部连接需求:

  • 工业自动化:PLC I/O模块与传感器的信号传输、伺服驱动器的控制排线、机器人关节的线束连接;
  • 消费电子:智能电饭煲控制板与显示模块、扫地机器人传感器与主板、智能家居网关的内部排线;
  • 通信设备:小型路由器的内部接口、光纤收发器的信号连接、4G模块的排线适配;
  • 适配性:兼容2mm间距的IDC排线(推荐26AWG~28AWG常规排线),弯插结构可直接匹配PCB板弯插焊盘布局,无需额外转接件。

四、性能参数与可靠性

基于行业标准与实际测试,核心性能参数如下(供参考):

  • 接触电阻:≤20mΩ(常温1A测试),金镀层保证低损耗;
  • 绝缘电阻:≥1000MΩ(500V DC测试),防止相邻针脚短路;
  • 耐温范围:-40℃~+105℃,符合工业级宽温要求;
  • 插拔寿命:≥500次,满足设备调试、维护的多次插拔需求;
  • 耐电压:AC500V/1min(无击穿、飞弧),确保电气安全;
  • 机械强度:单针插拔力1.8N~2.5N,连接牢固不易脱落。

五、选型与安装注意事项

  1. 选型匹配:确认设备需求的Pin数(10Pin)、间距(2mm)、安装方式(弯插),避免与直插连接器混淆;排线需选2mm间距、26~28AWG的IDC排线,确保刺破效果;
  2. 安装要点:排线插入时需垂直对准针脚,施加均匀压力直至排线完全到位(可听到轻微“咔嗒”声);安装后避免排线过度弯折(弯折半径≥5mm),防止针脚变形;
  3. 存储维护:未使用产品存储在常温(15℃~35℃)、干燥(相对湿度≤60%)环境,避免阳光直射或腐蚀性气体;若出现接触不良,优先检查排线是否插紧(无需担心金镀层氧化)。

该产品以高可靠性、快速安装为核心优势,可有效降低设备内部连接的成本与故障率,是中小间距连接场景的优选方案。

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