Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XKB Connectivity X1251H-04-N0 X1251H
Configuration
1 options
Configuration
Option 179474
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XKB Connectivity X1251H-04-N0
- Type
- XKB CONNECTIVITY
- Minimum package
- 2000 袋
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XKB CONNECTIVITY
- Electronic Component
- X1251H-04-N0
- Electronic Component
- 1
- Package
- Electronic Component
- Electronic Component
- 1
- Electronic Component
- (Wire-to-Board / Wire-to-Wire)
- Electronic Component
- 0.081g
- Electronic Component
- 1.25mm
- Electronic Component
- 1
- Electronic Component
- BM0265742888
- Electronic Component
- PA66
- Operating Temperature
- 25℃~+85℃
- Socket
- 1x4P
- Electronic Component
- Electronic Component
- PIN
- 4
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X1251H-04-N0 1.25mm线对板连接器概述
一、产品定位与兼容特性
X1251H-04-N0是中国星坤（XKB Connectivity）推出的JST GH系列兼容线对板连接器外壳（HSG），专为小间距、高密度连接场景设计。作为4Pin单排结构，其核心兼容JST GH系列端子与胶壳，可直接替代同规格进口产品——在保持电气性能一致性的前提下，有效降低BOM成本。产品定位聚焦小型化电子设备的内部核心连接，解决传统宽间距连接器无法适配的紧凑空间需求。
二、关键结构与电气参数
2.1 机械结构
- 间距与排数：1.25mm引脚间距（行业小间距标准），单排4Pin设计，总宽度仅约6mm，适配PCB板窄空间布局；
- 锁扣设计：内置防脱落锁扣（无额外锁扣占用空间），装配时端子推入外壳会触发“咔嗒”反馈，避免振动环境下的连接松动；
- 无翅结构：不带定位翅，适合PCB板无预留翅孔的紧凑场景（如智能穿戴设备主板）。
2.2 电气性能
- 额定电流：2A（AC/DC），满足小功率电源与信号传输需求；
- 额定电压：50V（AC/DC），符合多数民用/工业设备安全规范；
- 接触电阻：≤20mΩ（初始状态），绝缘电阻≥1000MΩ（常态），确保信号传输稳定无衰减。
三、材料与可靠性设计
3.1 外壳材料
采用PA66（聚酰胺66）工程塑料：
- 具备高强度、耐磨损特性，可承受多次插拔（插拔寿命≥100次）；
- 阻燃等级达UL94V-0，符合电子设备安全规范，降低火灾风险。
3.2 环境适应性
- 工作温度：-25℃~+85℃，覆盖民用（智能穿戴）、工业（传感器节点）及部分汽车电子（车载低功耗模块）场景；
- 耐湿热性能：符合IEC 60068-2-60标准，长期暴露在90%~95%相对湿度环境下仍保持稳定连接；
- 振动测试：通过10Hz~2000Hz振动测试（加速度98m/s²），无端子脱落或虚接问题，适合手持设备、车载仪表盘等振动场景。
四、典型应用场景
X1251H-04-N0因小间距、高可靠性特点，广泛应用于：
- 智能穿戴：智能手表电池与主板连接、心率/血氧传感器模块与主控板连接；
- 小型家电：智能音箱内部模块连接、无线耳机充电盒电源传输；
- 工业控制：PLC扩展IO模块、温度/压力传感器节点信号传输；
- 汽车电子：车载导航背光控制、行车记录仪电源与信号连接（非高压场景）。
五、安装与使用注意事项
- 端子匹配：需搭配星坤X1251T系列或JST GH系列对应端子使用，避免端子与外壳不兼容导致虚接；
- 装配操作：端子需完全推入外壳，听到锁扣反馈后确认到位，禁止强行弯折外壳；
- 温度限制：避免长期暴露在超过85℃或低于-25℃的环境中，防止塑料老化或端子性能下降；
- 清洁要求：装配前保持端子与外壳清洁，避免灰尘、油污影响接触电阻。
该产品平衡了小间距设计与可靠性，是小型化电子设备内部连接的高性价比选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
