WMSIC Electronic Components

XKB Connectivity X1251H-02-N0 X1251H

ModelX1251H-02-N0
PackageElectronic Component
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179487

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X1251H-02-N0
Type
XKB CONNECTIVITY
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X1251H-02-N0
Electronic Component
1
Package
Electronic Component
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.05g
Electronic Component
1.25mm
Electronic Component
1
Electronic Component
BM0265742959
Electronic Component
PA66
Operating Temperature
25℃~+85℃
Socket
1x2P
Electronic Component
Electronic Component
PIN
2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X1251H-02-N0 1.25mm间距2P带锁扣压线端子胶壳产品概述

一、产品核心规格参数

X1251H-02-N0是XKB Connectivity(星坤)推出的小间距压线端子胶壳,核心规格完全匹配消费电子、工业控制等领域的紧凑连接需求:

  • 结构布局:单排2Pin(1×2P),中心间距1.25mm(行业小间距主流标准);
  • 功能配置:带锁扣(防松脱)、不带固定翅(适配灵活安装);
  • 材料性能:PA66工程塑料主体,UL94V-0阻燃等级;
  • 环境适应性:工作温度范围-25℃~+85℃,满足常规工业及消费电子场景的温湿度要求;
  • 产品定位:压线端子配套胶壳(需与XKB对应压线端子配合使用)。

二、结构设计与可靠性优势

该胶壳的设计重点围绕紧凑性、防松脱、易组装三大核心:

  1. 带锁扣防松结构
    胶壳侧面集成卡扣式锁扣,与配套端子/接插件对接时可实现"咔嗒"锁定,有效抵抗振动、插拔冲击导致的意外松脱,尤其适合移动设备(如智能穿戴)或工业振动场景。
  2. 1.25mm小间距紧凑布局
    单排2Pin设计+1.25mm中心间距,可大幅节省PCB板空间及整机体积,完美适配轻薄化电子设备(如智能手机、蓝牙耳机)的内部连接需求。
  3. 无翅设计灵活适配
    不带PCB固定翅,可灵活适配无定位孔的PCB、软板(FPC)或柔性排线场景,同时降低安装难度,缩短批量生产的组装工时。
  4. 压线端子适配性
    需与XKB对应型号的压线端子(如X1251T系列)配合,压线工艺无需焊接,操作简单高效,适合自动化批量组装。

三、材料性能与安全认证

  1. PA66工程塑料的核心优势
    主体采用PA66(聚酰胺66),具备优异的机械强度(抗冲击、抗拉伸)、良好的耐化学性(耐油、耐弱酸碱)及稳定的电气绝缘性,长期使用不易老化变形,可承受多次插拔。
  2. UL94V-0高阻燃保障
    阻燃等级达到UL94V-0(垂直燃烧测试中,火焰离开后10秒内熄灭,无滴落物引燃棉层),符合全球主流安全认证(UL、CE)要求,可有效降低电子设备起火风险。
  3. 环保与认证齐全
    产品符合RoHS环保标准(无铅、无镉、无汞等有害物质),部分型号可提供SGS环保检测报告,适配全球市场准入要求。

四、典型应用场景

X1251H-02-N0的紧凑设计与可靠性能,使其广泛覆盖以下领域:

  1. 消费电子:智能手机/平板的电池、屏幕排线连接;智能手表/手环的微型模块连接;蓝牙耳机、便携音箱的内部布线。
  2. 工业控制:小型PLC的IO接口连接;温度/压力传感器的信号传输;小型工业机器人末端执行器的模块连接。
  3. 汽车电子:车载信息娱乐系统的内部布线;车身控制模块(BCM)的小型传感器连接;车载摄像头的信号传输。
  4. 智能家居:智能门锁的内部电路连接;智能音箱的模块连接;智能家居控制器的传感器接口。

五、品牌与定制化支持

XKB Connectivity(星坤)作为国内专业连接器制造商,该产品具备:

  • 品牌可靠性:通过ISO9001质量管理体系认证,批量产品一致性高,供货周期稳定;
  • 定制化服务:可根据客户需求提供颜色定制、表面标识、特殊端子适配等差异化服务;
  • 技术支持:提供完整的配套方案(胶壳+端子+针座)及安装指导,降低客户设计成本。

总结

X1251H-02-N0以小间距紧凑布局、可靠带锁扣设计、优异材料性能为核心优势,是消费电子、工业控制等领域中"小体积、高可靠"连接需求的高性价比选择,可有效提升设备的集成度与稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.