WMSIC Electronic Components

XKB Connectivity X2011HM-02A-N0 X2011HM

ModelX2011HM-02A-N0
PackageElectronic Component
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179516

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2011HM-02A-N0
Type
XKB CONNECTIVITY
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2011HM-02A-N0
Electronic Component
1
Package
Electronic Component
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.114g
Electronic Component
2mm
Electronic Component
1
Electronic Component
BM0265742896
Electronic Component
PA66
Operating Temperature
40℃~+125℃
Socket
1x2P
Electronic Component
Electronic Component
PIN
2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2011HM-02A-N0 2.0mm线对板连接器产品概述

X2011HM-02A-N0是中国星坤(XKB Connectivity)推出的一款2.0mm间距线对板连接器公壳(HSG),采用空接设计,专为紧凑空间内的信号/电源连接场景打造。产品凭借小间距、高可靠性、宽温阻燃等核心优势,适配消费电子、工业控制、汽车电子等多领域需求。

一、产品核心特性

该产品围绕紧凑空间连接的实际痛点,重点强化了小型化、可靠性、环境适应性三大方向:

  1. 小间距设计:采用2.0mm(P=2mm)标准间距,相比传统3.0mm间距连接器体积缩小约30%,可有效节省设备内部布线空间;
  2. 带锁扣结构:内置卡扣式锁扣,连接时实现可靠啮合,避免振动、冲击环境下的松脱,提升连接稳定性;
  3. 宽温阻燃:工作温度覆盖-40℃~+125℃,满足极端环境需求;塑料材质采用PA66,配合UL94V-0阻燃等级,具备优异的安全防护能力;
  4. 简化结构:不带翅设计,进一步降低安装空间要求,适配高密度布线场景。

二、关键参数解析

1. 电气与结构参数

  • 间距与针数:2.0mm间距、1排2PIN设计,满足双导线(如电源正负极、单路信号)的基础连接需求,适用于低引脚数的小型模块;
  • 结构细节:带锁扣(无额外固定翅片),空接设计(需配合对应公端子使用),公壳结构确保端子安装精准度;

2. 环境与材料参数

  • 工作温度:-40℃~+125℃,覆盖工业级、汽车级的宽温范围,可应对北方冬季低温(-40℃)及设备内部高温(如电源模块附近125℃);
  • 阻燃等级:UL94V-0,属于塑料阻燃的最高等级,离开火源后自熄时间≤10秒,有效防止火灾蔓延;
  • 塑料材质:PA66(聚酰胺66),具备高机械强度、耐冲击、耐油/耐溶剂性,长期使用不易老化变形。

三、材料与可靠性设计

1. PA66材质的优势

PA66作为连接器外壳的核心材料,解决了传统塑料(如ABS)耐温低、易脆裂的问题:

  • 熔点约260℃,可承受短期150℃以上的高温冲击;
  • 耐冲击强度达80J/m以上,避免安装或使用中的碰撞损坏;
  • 耐化学性优异,可抵抗常见的机油、清洁剂等腐蚀。

2. 锁扣结构的可靠性

带锁扣设计是产品抗振动性能的关键:

  • 卡扣采用倒钩式结构,连接时需施加轻微压力即可啮合,拆卸时需按压锁扣解锁,操作便捷且防误触;
  • 经过振动测试(符合IEC 60068-2-6标准),在10Hz~2000Hz振动频率下,连接电阻变化≤5mΩ,满足工业、汽车设备的振动要求。

四、典型应用场景

X2011HM-02A-N0因小型化、高可靠性,适配以下场景:

  1. 消费电子:智能音箱、小型加湿器、蓝牙耳机充电盒等设备的内部电源/信号连接,2mm间距适配产品小型化趋势;
  2. 工业控制:小型PLC、传感器模块、电机驱动器的辅助电路连接,宽温与阻燃满足工业现场的 harsh环境;
  3. 汽车电子:车载充电器、仪表盘辅助功能(如氛围灯)、倒车雷达模块的连接,锁扣结构可应对汽车行驶中的振动;
  4. 通信设备:小型路由器、交换机的内部排线,不带翅设计适配高密度布线需求。

五、安装与使用注意事项

为确保产品性能,使用时需注意:

  1. 端子匹配:空接设计需配合星坤对应公端子(参考产品手册),避免端子与外壳不兼容导致虚接;
  2. 锁扣确认:安装时需听到“咔嗒”声,确认锁扣完全啮合,否则可能在振动下松脱;
  3. 环境防护:避免长期暴露在强腐蚀性气体(如硫化氢、氯气)中,虽PA66耐化学,但强腐蚀环境需额外防护;
  4. 温度限制:不要超过工作温度上限125℃,否则外壳可能变形,影响连接可靠性。

总结

X2011HM-02A-N0作为星坤2.0mm系列的核心产品,以小型化设计、高可靠性锁扣、宽温阻燃材料为核心,精准适配多领域紧凑空间的连接需求。无论是消费电子的小型化升级,还是工业/汽车设备的 harsh环境应用,均能提供稳定可靠的连接方案。

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