WMSIC Electronic Components

XKB Connectivity X2011HM-04A-N0 X2011HM

ModelX2011HM-04A-N0
PackageElectronic Component
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179547

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2011HM-04A-N0
Type
XKB CONNECTIVITY
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2011HM-04A-N0
Electronic Component
1
Package
Electronic Component
Electronic Component
1
Electronic Component
0.191g
Electronic Component
2mm
Electronic Component
1
Electronic Component
BM0265742916
Electronic Component
PA66
Operating Temperature
40℃~+125℃
Socket
1x4P
Electronic Component
Electronic Component
PIN
4
Electronic Component
UL94V-0

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2011HM-04A-N0 线对板连接器产品概述

X2011HM-04A-N0是XKB Connectivity(中国星坤) 推出的一款小间距线对板(Wire-to-Board)公端连接器外壳(HSG),主打紧凑设计、高可靠性与宽环境适应性,适用于对空间、温区、阻燃性有要求的电子设备内部信号/电源传输场景。

一、核心定位与产品类型

该产品属于单排4Pin公端空接连接器,采用2mm标准间距设计,定位为中低端距、高性价比的基础连接组件,主要配合同系列母端连接器及对应端子使用,实现电线与PCB板之间的稳定电气连接。

二、关键参数深度解析

1. 间距与针数配置

  • 间距:2mm(P=2mm),属于行业常见小间距规格,兼顾连接密度与安装便利性;
  • 针数:1排4Pin,满足4路信号/电源的传输需求,适配小型化设备的多通道连接。

2. 结构设计特性

  • 带锁扣:采用卡扣式自锁结构,插拔力适中(需结合端子规格),连接后可有效防止振动、冲击导致的意外脱落,提升机械可靠性;
  • 无翅设计:外壳无固定翅片,仅通过端子或PCB焊盘实现固定,大幅减少板端占用空间,适合紧凑PCB布局。

3. 材质与性能参数

  • 塑料外壳:PA66(聚酰胺66)材质,具有优异的韧性、耐冲击性与抗老化性能;
  • 阻燃等级:UL94V-0,符合严苛的安全阻燃标准,可降低设备起火风险;
  • 工作温区:-40℃~+125℃宽温范围,适应高低温交替的复杂环境(如户外、车载场景);
  • 环保要求:符合RoHS、REACH等主流环保认证(星坤常规产品线标配)。

三、结构与材质优势

  1. PA66外壳的综合性能:PA66材质不仅耐温范围宽,还具备良好的耐化学腐蚀性(如耐油、耐弱酸),可应对工业、汽车等场景的复杂环境;
  2. 锁扣机制的可靠性:自锁设计可通过明显的“咔嗒”声确认连接到位,避免虚接,同时插拔循环次数可达数千次(结合端子性能),满足长期使用需求;
  3. 无翅设计的空间适配性:无翅结构简化了PCB布局,尤其适合小型手持设备、微型模块等对尺寸敏感的产品,无需预留额外的固定孔位。

四、典型应用场景

X2011HM-04A-N0因紧凑设计、宽温适配与高可靠性,广泛应用于以下领域:

  1. 工业控制设备:PLC模块、传感器节点、小型伺服系统,应对工业现场的振动与温变;
  2. 汽车电子:车载辅助传感器(如胎压监测、倒车雷达)、中控小模块,锁扣设计可抵御汽车行驶中的振动;
  3. 消费电子:智能家居设备(智能门锁、温湿度传感器)、小型家电控制板,满足紧凑空间需求;
  4. 医疗电子:手持监测仪器(如血糖监测仪、便携式血氧仪),阻燃V-0符合医疗设备安全标准;
  5. 通信终端:小型光纤收发器、边缘计算模块,宽温性能保障户外基站的稳定运行。

五、品牌与可靠性保障

作为XKB Connectivity的基础连接器产品,X2011HM-04A-N0依托星坤的制造实力与质量管控体系,具备以下优势:

  • 成熟供应链:星坤拥有完整的连接器生产链,端子与外壳匹配性好,减少兼容性问题;
  • 质量认证:产品通过UL、CUL等安全认证,符合全球主流市场的准入要求;
  • 定制化潜力:可根据客户需求调整针数(如扩展至6Pin、8Pin)、锁扣形式等(需提前沟通)。

综上,X2011HM-04A-N0以其紧凑设计、宽温适配与高可靠性,成为小间距线对板连接场景的高性价比选择,适用于多领域电子设备的内部信号/电源传输需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.