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XKB Connectivity X1002T-PSN2 X1002T
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XKB Connectivity X1002T-PSN2
- Type
- XKB CONNECTIVITY
- Minimum package
- 20000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XKB CONNECTIVITY
- Electronic Component
- X1002T-PSN2
- Electronic Component
- 1
- Package
- Electronic Component
- Electronic Component
- Terminal Block
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0265743027
- AWG
- 28~32
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 20000
- (OD)
- 0.8mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
X1002T-PSN2 产品概述
一、产品简介
X1002T-PSN2 是中国星坤（XKB Connectivity）推出的一款 1.00mm 间距线对板连接器用端子（SH 系列），专为微小间距、低压信号与轻载供电场合设计。端子采用磷青铜材料，先冲后镀锡工艺处理，适配细径导线，实现紧凑且可靠的接触结构。
二、主要参数
- 线规（AWG）：28 ~ 32
- 允许绝缘外径（OD）：最大 0.8 mm
- 触头材质：磷青铜（Phosphor Bronze）
- 触头镀层：锡（先冲后镀锡）
- 额定电压：50 V
- 接触间距：1.00 mm（线对板，SH 型）
（注：工作电流受线径、接触面积及散热条件影响。一般参考值：AWG28 可在约 1.0–1.5A 范围，AWG32 可在约 0.5–0.8A 范围；实际应用请按具体环境与温升验证。）
三、结构与材料说明
端子采用冲压成型后进行镀锡处理，磷青铜基材提供良好的弹性、导电性和耐疲劳特性；锡镀层有利于防氧化、提高焊接性与长期接触可靠性。1.00mm 的微间距设计，可实现高密度布线与插拔配合，适用于空间受限的产品结构。
四、性能与优点
- 小体积、高密度：1.00mm 间距节省 PCB 空间，适合紧凑型产品。
- 稳定接触：磷铜弹性好，接触压力稳定，保证长期电气连接可靠。
- 成本与可加工性好：先冲后镀锡工艺适合批量生产，锡层兼顾成本与防护性。
- 适配细线：支持 AWG28~32 的常见细径线缆，绝缘 OD ≤ 0.8 mm。
五、适用场景
适用于低压信号传输与轻载供电场景，例如：便携式电子、智能穿戴、物联网模块、微型外设连接、传感器线缆连接与其他空间受限的线对板连接应用。
六、装配与使用建议
- 裸线加工与压接需使用与端子匹配的压着模具，保证压接质量与接触面积。
- 线缆绝缘直径不应超过 0.8 mm，以确保插入力与接触可靠性。
- 使用环境应避免超出额定电压（50V）与过高温度，必要时进行温升评估。
- 长期存放或使用于腐蚀性环境时，建议加装保护措施或选用镀层更高防护等级的版本。
七、采购与技术支持
XKB Connectivity（中国星坤）提供 X1002T-PSN2 的样品与批量供货、标准包装与质量检验记录。对于具体电流额定、耐久寿命（插拔次数）、推荐压接模具及 PCB 布局建议，请联系厂方索取详细数据手册与工程支持，以便完成可靠的系统设计与量产验证。
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