WMSIC Electronic Components

XKB Connectivity X2011WVS-03A-9TSN X2011WVS

ModelX2011WVS-03A-9TSN
PackageSMT
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2011WVS-03A-9TSN
Type
XKB CONNECTIVITY
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2011WVS-03A-9TSN
Electronic Component
1
Package
SMT
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
1.06g
Electronic Component
2mm
PIN
3P
Electronic Component
1
Electronic Component
BM0259546133
Electronic Component
PA9T
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Pin
1x3P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2011WVS-03A-9TSN 产品概述

一、产品简介

X2011WVS-03A-9TSN 为 XKB Connectivity(中国星坤)推出的 2.0mm 间距线对板连接器(YH 2.0 系列)针座,型号描述为“2.0mm 线对板连接器(YH 2.0)针座, 立贴, 亮锡, 9T料, 03P”。该件为单排 1×3P 结构,采用立贴(垂直)SMD 封装,适用于线对板连接的紧凑型电路设计。

二、核心参数

  • 插针结构:1×3P(单排 3 PIN)
  • 间距(Pitch):2.0 mm
  • 封装与安装方式:SMD,立贴(垂直贴装)
  • 额定电流:3 A(每脚)
  • 额定电压:250 V
  • 触头材质:黄铜(Brass)
  • 触头镀层:亮锡(Sn)
  • 塑料材质:PA9T,阻燃等级 UL94V-0
  • 工作温度范围:-25 ℃ ~ +85 ℃
  • X 轴板上底边长度(间距线):10 mm

三、设计与性能特点

  • 高可靠接触:黄铜触头配以亮锡镀层,保证良好的导电性与抗氧化性能,适合中等电流应用。
  • SMT 兼容:立贴 SMD 结构便于自动贴装与回流焊工艺,提高生产效率。
  • 阻燃且耐热:外壳采用 PA9T 材料并达到 UL94V-0 阻燃等级,提升安全性与可靠性。
  • 紧凑布局:2.0mm 间距与 1×3P 单排结构,适合空间受限的板端连接需求。
  • 稳定的机械强度:立贴插针设计利于线缆插拔、振动环境下保持接触稳定。

四、典型应用场景

  • 家用电器与消费电子:模块与主板之间的线束连接、显示器或外壳内部连线。
  • 工业控制与仪器仪表:中等电流信号/电源连接、控制板间模块互联。
  • 通信设备与网络终端:板对线缆的可靠连接方案。
    (注:如用于特殊环境或更高温度/振动要求,请参照厂方更高等级产品或进行可靠性验证。)

五、安装与选型要点

  • 焊接工艺:推荐采用标准 SMD 贴装与回流焊工艺,实际回流温度曲线请依据 PA9T 与镀锡接头的耐热性并参照 XKB 提供的工艺说明。
  • 机械应力:立贴结构在插拔时会对焊点产生力矩,应在产品设计阶段评估线缆固定与应力释放措施。
  • 电气匹配:额定 3A/250V,选型时请根据实际电流裕量及温升要求留有安全余量。
  • 表面处理:亮锡镀层利于焊接与导电,但存储与长期暴露环境需防潮防污染以避免接触劣化。

六、包装与订购信息

  • 品牌:XKB Connectivity(中国星坤)
  • 型号:X2011WVS-03A-9TSN
  • 描述:2.0mm 线对板连接器,立贴 SMD,亮锡,PA9T,03P
    如需大批量采购、样品或 3D/2D 尺寸图、回流曲线与可靠性测试报告,请联系 XKB 官方或指定分销商获取最新资料与技术支持。

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