WMSIC Electronic Components

XKB Connectivity X2026WV-2X06D-46SN X2026WV

ModelX2026WV-2X06D-46SN
PackageDIP
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 179839

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2026WV-2X06D-46SN
Type
XKB CONNECTIVITY
Minimum package
440 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2026WV-2X06D-46SN
Electronic Component
1
Package
DIP
Electronic Component
2
Electronic Component
Wire-to-Board
Electronic Component
2mm
Electronic Component
0.68g
Electronic Component
2mm
PIN
12P
Electronic Component
5
Electronic Component
PHD
Electronic Component
BM0265845629
Electronic Component
PA46
Electronic Component
Through-hole

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2026WV-2X06D-46SN 线对板针座产品概述

一、产品核心定位与基础规格

X2026WV-2X06D-46SN是中国星坤(XKB Connectivity)推出的中功率线对板直插式针座,专为常规电路的可靠连接设计。其核心插针结构为2排×6PIN(总12PIN),针距(中心距)2mm,行距2mm,采用180°直插安装方式,适配对应线端连接器(如PHD系列)实现电路导通,是替代传统端子连接的高效方案。

二、关键性能参数解析

1. 电气性能

  • 额定电流:3A(AC/DC通用),满足小型电机、传感器、继电器等中低功率负载需求;
  • 额定电压:250V,适配家用及工业低压电路(≤250V AC/DC);
  • 触头接触:黄铜基底+锡镀层,接触电阻≤20mΩ(初始状态),长期工作无明显发热,避免信号衰减或短路风险。

2. 环境适应性

  • 工作温度:-25℃~+85℃,覆盖温带、亚热带地区设备的常规使用环境(如室内工业设备、车载辅助系统);
  • 阻燃等级:UL94V-0,塑料壳体遇火时可快速自熄,抑制火焰蔓延,符合设备安全规范。

3. 机械性能

  • 耐插拔次数:≥500次(典型值),满足设备生命周期内的维护需求;
  • 安装方式:直插通孔焊接,适配常规1.6mm厚PCB板,插针长度精准,避免虚焊或插针外露。

三、材料与工艺优势

1. 触头系统

采用黄铜+锡镀层设计:黄铜基底确保导电率(≈40%IACS)与机械强度,表面锡镀层(厚度≥2μm)提升耐腐蚀性(避免氧化导致接触不良),且镀层无铅(符合RoHS环保标准)。

2. 塑料壳体

选用PA46(聚酰胺46) 材料:相比普通PA66,连续使用温度可达120℃(远超工作上限85℃),耐化学性(抗油污、弱酸碱)更强,且抗冲击性优异,可承受设备振动环境。

3. 结构设计

  • 180°直插结构:简化焊接流程,插针与PCB垂直,避免侧插导致的应力集中;
  • 双排PIN布局:2mm针距兼顾连接密度与安装便利性,相邻PIN间距合理,无短路隐患。

四、典型应用场景

该针座因性能均衡、成本可控,广泛适配以下领域:

  • 工业控制:PLC模块、传感器接口、小型继电器座(如机床辅助电路);
  • 消费电子:智能家居(智能网关、传感器节点)、小型家电(加湿器、智能插座);
  • 汽车电子:车载辅助系统(倒车雷达、胎压监测模块);
  • 通信设备:小型路由器、交换机的内部子板连接。

五、安装与可靠性说明

1. 安装注意事项

  • 焊接温度:≤260℃(单次焊接时间≤3秒),避免高温损坏PA46壳体;
  • 插针插入:需完全插入PCB通孔(深度≥1.2mm),焊接后清理残留焊锡,确保无短路。

2. 可靠性保障

  • 匹配性:与星坤PHD系列线端连接器精准匹配,接触紧密无松动;
  • 长期稳定性:触头无氧化、壳体无老化,1000小时老化测试后性能衰减≤5%。

该产品以高性价比、稳定可靠的特性,成为中低功率电路连接的主流选择,适配多行业设备的量产需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.