WMSIC Electronic Components

XKB Connectivity TS-1185-C-A-B-A

ModelTS-1185-C-A-B-A
PackageSMD
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity TS-1185-C-A-B-A
Type
XKB CONNECTIVITY
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
TS-1185-C-A-B-A
Electronic Component
1
Package
SMD
Electronic Component
Electronic Component
Electronic Component
Switch
Electronic Component
0.136g
Electronic Component
2.6N
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM69416213
Electronic Component
Electronic Component
Electronic Component
10
Operating Temperature
30℃~+85℃
Switch
3mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS-1185-C-A-B-A 产品概述

1. 产品背景

在现代电子产品设计中,轻触开关作为一种重要的用户界面组件,广泛应用于各类电子设备中,如智能手机、数码相机、音响系统以及各种家用电器。轻触开关以其稳定性和可靠性,成为了设计师的优选部件之一。TS-1185-C-A-B-A是一款由中国星坤(XKB Connectivity)旗下生产的小型贴片轻触开关,具有多种优越的性能特征,适合多种市场需求。

2. 产品规格

  • 型号: TS-1185-C-A-B-A
  • 类型: 轻触开关
  • 尺寸: 3mm x 4mm x 2.0mm
  • 封装: SMD(表面贴装器件)
  • 脚数: 2脚
  • 按压力: 260gf
  • 外壳材质: 塑料
  • 按钮颜色: 黑色
  • 定位柱: 不带定位柱(适用于多种灵活设计)

3. 设计与材料

TS-1185-C-A-B-A轻触开关的设计充分考虑了用户的操作体验,其小巧的尺寸(3x4x2.0mm)极大地方便了高密度电路板的应用,特别适合手机、智能手表及移动电子设备等对空间要求严格的产品。该开关采用工业级塑料制造,确保了足够的耐用性和抗腐蚀性,同时避免了在不同温度和湿度条件下的性能下降。

4. 操作原理

轻触开关的基本工作原理是通过机械触点的接触来实现电路的打开或关闭。TS-1185-C-A-B-A在受到260gf的按压力下,能够瞬间完成按钮的闭合,实现电气信号的传输。这种设计确保了开关操作的低延迟和高灵敏度,使得用户在操作时能够获得良好的反馈体验。

5. 应用场景

TS-1185-C-A-B-A广泛适用的领域包括:

  • 消费电子产品: 在智能手机、平板电脑、数码摄像机等产品中,作为电源开关或模式切换开关。
  • 医用设备: 在便携式医疗器械中,开关用于简单的功能选择和控制,确保操作的简洁性和可靠性。
  • 可穿戴设备: 由于其极小的尺寸和较轻的自重,这款开关非常适合用于手表、智能手环等可穿戴产品中。
  • 家用电器: 用于实现简单控制功能,如开关、调节等。

6. 性能优越性

与市场上其他同类产品相比,TS-1185-C-A-B-A在多个方面展现出优越性。首先,小巧的体积使其在要求紧凑设计的产品中独树一帜。其次,260gf的按压力设计,确保了使用过程中的良好操作反馈,减少了误触的可能性。同时,SMD封装形式的设计,使得在生产自动化过程中安装便利,能够有效提高生产效率。

7. 结论

综上所述,TS-1185-C-A-B-A轻触开关结合了小巧的体积、良好的操作体验和可靠的性能,为设计师们提供了极大的设计灵活性,尤其适合现代各种高科技电子产品。在将来,随着技术的不断进步和产品需求的变化,TS-1185-C-A-B-A将继续发挥其在电子领域的重要作用,助力更多创新产品的诞生。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.