WMSIC Electronic Components

XKB Connectivity X10A20L28G

ModelX10A20L28G
PackageSMD, P=1mm
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X10A20L28G
Type
XKB CONNECTIVITY
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X10A20L28G
Electronic Component
1
Package
SMD, P=1mm
Electronic Component
FFC / FPC Connector
Electronic Component
1g
Electronic Component
1mm
Electronic Component
1
Electronic Component
BM0265067192
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
28P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X10A20L28G 产品概述

一、产品简介

X10A20L28G 是 XKB Connectivity(中国星坤)推出的一款低高度 FPC 连接器,采用翻盖式锁定机构与下接触点设计,针脚数 28P,间距 1.0mm,板上高度 H=2.0mm,适用于对厚度为 0.3mm 的柔性电缆(FPC)接入。封装为 SMD、卧贴安装,面向空间受限且需可靠接触的消费电子、便携设备和工业控制类产品。

二、主要参数

  • 型号:X10A20L28G
  • 品牌:XKB Connectivity(中国星坤)
  • 接触方式:翻盖式锁紧(翻盖式)
  • 触点类型:下接
  • 触点数量:28P
  • 间距:1.0 mm
  • 支持 FPC 厚度:0.3 mm
  • 板上高度:2.0 mm(低高度设计)
  • 安装方式:SMD,卧贴安装
  • 触头材质:磷青铜
  • 触头镀层:金(提高接触可靠性与抗氧化性能)
  • 工作温度:-25 ℃ ~ +85 ℃

三、结构与材料特点

  • 翻盖式锁扣:便于装配并保证 FPC 插入后可靠固位,减少接触不良风险。
  • 下接触点:触点位于底部,有利于与 FPC 导线端对端精确接触,改善信号完整性。
  • 磷青铜触头 + 镀金处理:兼顾弹性、导电性与抗氧化能力,适合高可靠性信号传输场景。
  • 低高度与卧贴封装:适配薄型终端产品的空间布局与表面贴装工艺。

四、典型应用场景

  • 智能手表、平板电脑与超薄笔记本中的显示或触控排线连接
  • 摄像模组、指纹模组与小型传感器的柔性线路连接
  • 车载信息娱乐、工业人机界面等需长期稳定连接的电子设备

五、安装与焊接建议

  • 建议采用标准无铅回流焊工艺进行贴装,焊接温度曲线与预热/冷却速率应遵循器件数据手册或 PCB 制造商建议,避免过高温度或过快冷却造成机械应力。
  • 由于为卧贴 SMD 结构,焊盘设计应保证焊膏量适中,避免桥联或虚焊;焊盘与过孔布局应考虑焊接后的可靠性与可清洗性。
  • 插入 FPC 时先打开翻盖,确保 FPC 与触点对齐后轻推并锁上翻盖,避免倾斜插入造成触点损伤。

六、使用与储存注意事项

  • 使用过程中避免超出额定工作温度范围(-25 ℃ ~ +85 ℃);长期在潮湿或腐蚀性气氛中应采取防护措施。
  • 触头为镀金,虽具抗氧化性但仍建议避免与腐蚀性化学物质接触;搬运与存储时避免强酸、强碱及含硫环境。
  • 支持多次插拔,但具体寿命请以出厂数据手册为准;频繁插拔会加速触点磨损。
  • 建议按出货包装保存在干燥盒内,避免强振动或重压变形。

七、选型与订购提示

  • 如需不同 FPC 厚度、不同高度或其他安装方向(直插、侧插等),请联系 XKB 技术支持获取对应型号与 PCB 布局文件。
  • 采购时请确认样品与量产数据手册一致,并要求提供封装图、焊盘建议和可靠性测试报告以便快速导入生产。

如需 2D/3D 封装图、焊盘建议或电气与机械耐久性测试数据,可提供具体项目需求以便获取更详细资料。

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