Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XKB Connectivity TM-8764-1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XKB Connectivity TM-8764-1
- Type
- XKB CONNECTIVITY
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XKB CONNECTIVITY
- Electronic Component
- TM-8764-1
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- Switch
- Electronic Component
- 0.22g
- Electronic Component
- 1
- Electronic Component
- BM0265109687
- Electronic Component
- 10
- Operating Temperature
- 40℃~+85℃
- Switch
- 3.7mm
- Switch
- 4.75mm
- Switch
- 2.25mm
- Electronic Component
- Electronic Component
- Button
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TM-8764-1 产品概述
一、产品简介
TM-8764-1 是由 XKB Connectivity（中国星坤）推出的一款立贴式检测开关，适用于要求低行程、可靠触发的检测与按键场合。开关采用角拨动按钮和带定位柱的SMD封装，体积小巧，便于自动贴装与批量生产，适合消费类电子及轻型工业设备的状态检测需求。
二、主要技术参数
- 电路结构：双刀单掷（常开，双路常开触点）
- 额定电流（DC）：100 mA
- 额定电压（DC）：30 V
- 工作寿命：100,000 次（典型）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装形式：SMD，鸥翼型引脚，带定位柱
- 外形尺寸：长 4.75 mm × 宽 3.7 mm × 高 2.25 mm
- 按钮形状：角拨动（角度拨动机构）
三、结构与封装特点
TM-8764-1 采用立贴（surface-mount）封装并配置定位柱，便于回流焊后保持位置精度；鸥翼型引脚便于实现可靠焊接与可视检查。角拨动按钮提供明确的触发手感和高重复性，双刀单掷设计可同时提供两路常开信号输出，便于冗余或多路检测。
四、性能与可靠性
该型号在额定工况下支持最长达10万次的机械寿命，适用于中等频次的开关动作场合；宽温度范围确保在较大环境温差下仍能稳定工作。建议在实际应用中进行电气寿命与环境试验验证，以匹配具体的使用频率与可靠性要求。
五、封装与焊接建议
- 采用标准SMD贴装工艺，定位柱可作为贴装基准点；
- 遵循厂家无铅回流曲线进行焊接，避免过高温度或过长保温时间；
- 焊盘设计应兼顾机械强度与焊接量，推荐在PCB上为定位柱设置对应孔位或凹位以提升抗振动性能；
- 建议在成品中进行功能与耐久性抽样检测，评估回流后触点可靠性。
六、典型应用场景
适用于便携设备检测、摄像模组限位检测、打印机/复印机位置开关、消费电子按键检测、物联网终端状态感知及轻型工业控制等场合，尤其适合空间受限且需表面贴装的产品设计。
七、选型与采购建议
选型时确认开关触点类型（双刀常开是否满足系统需求）、额定电压电流是否与负载匹配以及PCB布局对定位柱的支持。采购时请向 XKB Connectivity 确认最新的产品数据手册、回流曲线和可靠性报告，以便在量产前完成必要的样件验证与环境测试。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
