WMSIC Electronic Components

XKB Connectivity X6511WV-02H-C60D30 X6511WV

ModelX6511WV-02H-C60D30
PackageThrough-hole, P=2.54mm
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X6511WV-02H-C60D30
Type
XKB CONNECTIVITY
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X6511WV-02H-C60D30
Electronic Component
2.5mm
Electronic Component
1
Package
Through-hole, P=2.54mm
Electronic Component
Electronic Component
Electronic Component
Pin Header
Electronic Component
2.54mm
Electronic Component
0.117g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265810076
Operating Temperature
40℃~+105℃
PIN
2P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X6511WV-02H-C60D30排针产品概述

X6511WV-02H-C60D30是XKB Connectivity(中国星坤) 推出的2.54mm间距单排直插方针排针,针对小功率信号与电源传输场景优化设计,具备紧凑结构、高可靠电气性能及宽温适应性,可满足多领域电子设备的连接需求。

一、核心规格参数

该产品的基础参数清晰适配小空间连接场景,关键信息如下:

  • 连接结构:单排直插,1×2P(2芯)方针布局,无多余PIN位占用空间;
  • 间距规格:针距2.54mm,行距2.54mm(与行业标准一致,兼容主流连接器);
  • 尺寸参数:塑高仅2.5mm,适配0.8~1.6mm厚度的PCB板;
  • 电气额定值:额定电流3A(AC/DC)、额定电压250V(AC/DC),覆盖小功率配电需求;
  • 环境参数:工作温度-40℃~+105℃,可应对高低温复杂场景;
  • 材质镀层:触头为黄铜基材+高镀金处理,塑壳为黑色耐高温工程塑料;
  • 封装方式:直插式穿孔焊接,兼容波峰焊、手工焊等组装工艺。

二、结构设计特点

产品结构聚焦紧凑性与兼容性,解决小空间连接痛点:

  1. 方针触头优势:相比圆针,方针的平面接触可提升与连接器的接触面积,降低接触电阻波动(典型值<10mΩ),同时增强插拔稳定性,避免虚接;
  2. 低塑高设计:2.5mm塑高可适配智能穿戴、小型传感器等空间受限设备,无需额外垫高PCB;
  3. 单排2芯布局:仅针对小功率信号(如I2C、UART)或单路电源(5V/12V)设计,避免资源浪费;
  4. 直插封装可靠性:穿孔焊接方式可通过波峰焊实现批量组装,手工焊也易操作,焊接后连接牢固,抗振动性能优于贴片封装。

三、电气性能表现

电气性能是该排针的核心竞争力,关键表现如下:

  • 高导电效率:黄铜触头导电率约27×10⁶ S/m,配合镀金镀层进一步降低接触电阻,减少信号传输损耗,适合中等速率信号(如1Mbps以下)传输;
  • 稳定载流能力:3A额定电流可满足5V/12V系统的电源连接,避免过流导致的触头发热或氧化;
  • 耐高压特性:250V额定电压符合工业控制、家电等场景的低压配电安全标准,无需额外防护。

四、材料与镀层优势

材料选择直接决定产品寿命与可靠性:

  • 触头材质:黄铜(CuZn合金)兼具优异导电性能与机械强度,可承受1000次以上插拔而不出现触头变形;
  • 高镀金镀层:镀层可有效防止触头氧化(尤其是潮湿、高温环境),同时降低接触磨损,延长产品使用寿命;
  • 塑壳材料:黑色耐高温工程塑料(如PA66),耐温范围与产品工作温度匹配,具备良好绝缘性与抗冲击性,符合RoHS无铅环保要求。

五、环境适应性分析

该排针可适应多种复杂场景:

  • 宽温覆盖:-40℃+105℃覆盖工业现场(-2085℃)、车载电子(-4085℃)、消费电子(070℃)等主流场景,低温下不脆裂,高温下不软化;
  • 抗腐蚀性能:镀金镀层可抵抗湿气、盐雾侵蚀,适合沿海地区或户外设备内部连接;
  • 抗振动能力:方针结构与直插焊接方式可减少振动导致的接触不良,适合车载、工业机器人等振动场景。

六、典型应用场景

基于上述特性,该排针适用于以下场景:

  1. 智能穿戴:智能手环、蓝牙耳机的传感器与主板连接,利用低塑高适配紧凑空间;
  2. 工业控制:PLC扩展接口、温度/湿度传感器节点的信号连接,依赖宽温与抗振动性能;
  3. 消费电子:机顶盒内部电源跳线、路由器信号接口,符合3A载流需求;
  4. 车载电子:车载显示屏的小功率控制信号连接,适应车载温区与振动环境;
  5. 小型医疗设备:便携式血糖仪的内部组件连接,要求低接触电阻与高可靠性。

X6511WV-02H-C60D30排针通过紧凑结构、高可靠性能与宽环境适应性,成为小功率连接场景的高性价比选择,可满足多领域电子设备的定制化需求。

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