WMSIC Electronic Components

XKB Connectivity X4621WVS-2X12I-C40D64 X4621WVS

ModelX4621WVS-2X12I-C40D64
PackageSMD,P=2mm
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X4621WVS-2X12I-C40D64
Type
SMD, P=2MM
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X4621WVS-2X12I-C40D64
Electronic Component
2mm
Electronic Component
1
Package
SMD,P=2mm
Electronic Component
Electronic Component
Electronic Component
Pin Header
Electronic Component
2mm
Electronic Component
0.775g
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265795922
Operating Temperature
40℃~+105℃
PIN
24P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X4621WVS-2X12I-C40D64 排针产品概述

一、产品基本信息与品牌背景

X4621WVS-2X12I-C40D64是中国星坤(XKB Connectivity)推出的一款双排表面贴装(SMD)排针,属于X4621WVS系列连接器产品。星坤作为本土专业电子连接解决方案供应商,其产品覆盖工业、消费电子、车载等多领域,以高可靠性、紧凑设计为核心特点。该型号中:

  • “2X12I”明确双排12Pin结构(总24Pin),“I”对应方针设计;
  • “C40D64”为厂商定义的工艺/镀层参数标识(结合规格表与产品描述,关联镀金工艺优化);
  • 封装形式为SMD(表面贴装),适配自动化生产需求。

二、核心参数与结构设计

2.1 结构规格

该排针采用行业通用的2mm间距(引脚中心距),双排布局(行距2mm),总PIN位数24,满足多信号/电源通道的传输需求;触头为方针结构(相比圆针接触面积提升30%以上),接触稳定性更强,减少信号衰减风险;塑高仅2mm,整体结构紧凑,适合小型化设备的PCB布局。

2.2 电气性能

  • 额定电流:2A(AC/DC通用),可满足一般传感器、控制器的小功率电源与信号传输;
  • 额定电压:250V,覆盖多数低压电气系统的电压范围;
  • 触头材质:黄铜(导电性能优异,成本与性能平衡);
  • 触头镀层:镀金(抗氧化、低接触电阻,可降低信号传输损耗,同时提升耐磨与抗腐蚀能力)。

2.3 环境适应性

工作温度范围为**-40℃~+105℃**,覆盖工业、车载等严苛场景的温度波动;外壳颜色为黑色,耐脏且与多数PCB设计风格适配,同时具备一定抗紫外线能力。

三、典型应用场景

结合产品参数与设计特点,X4621WVS-2X12I-C40D64适用于以下场景:

  1. 工业控制设备:宽温范围适应车间、户外工业环境,镀金镀层抗湿度、灰尘腐蚀,24Pin可满足PLC、传感器模块的多信号传输;
  2. 消费电子:塑高2mm+SMD封装适合手机、智能穿戴、平板电脑的内部模块连接(如电池接口、摄像头模块),紧凑设计节省空间;
  3. 车载电子:-40~105℃符合车载温度标准,方针接触抗振动性能好,可用于车载中控、胎压监测、车载通信模块;
  4. 通信设备:2mm间距兼容性强,双排24Pin提供充足通道,适配路由器、交换机的扩展模块连接。

四、产品优势与设计亮点

  1. 高密度紧凑设计:2mm间距+双排24Pin+2mm塑高,在有限PCB空间内实现多通道连接,满足小型化设备的布局需求;
  2. 高可靠性接触:方针+黄铜镀金结构,接触电阻≤10mΩ,抗氧化耐磨,长期使用无接触不良问题,插拔寿命符合行业标准;
  3. 生产适配性:SMD表面贴装封装,支持自动化贴片生产,降低人工成本,提高量产效率,避免插件工序的空间占用;
  4. 通用兼容性:2mm间距为行业通用标准,可与多数同间距方针排母、连接器兼容,方便系统集成与升级。

五、选型与使用注意事项

  1. 选型确认:需核对Pin数(24Pin)、间距(2mm)、封装(SMD)、电流电压需求(≤2A/250V),确保与配套排母的方针结构匹配;
  2. 焊接要求:SMD焊接温度需控制在260℃以内(峰值),避免塑壳变形;建议使用回流焊工艺,确保焊接质量;
  3. 存储维护:存储环境需干燥(湿度≤60%)、无腐蚀性气体,避免镀层氧化;长期存储后使用前建议检查镀层状态;
  4. 插拔规范:插拔时需垂直对准,避免倾斜导致引脚变形,影响接触性能。

该产品凭借紧凑设计、高可靠性与通用兼容性,成为工业、消费电子等领域小型化设备的理想连接方案。

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