WMSIC Electronic Components

XKB Connectivity TC-1102-C-I-B

ModelTC-1102-C-I-B
PackageThrough-hole
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity TC-1102-C-I-B
Type
XKB CONNECTIVITY
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
TC-1102-C-I-B
Electronic Component
1
Package
Through-hole
Electronic Component
Electronic Component
Electronic Component
Switch
Electronic Component
0.289g
Electronic Component
2.6N
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265148890
Electronic Component
Through-hole
Electronic Component
30
Operating Temperature
30℃~+85℃
Switch
6mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC-1102-C-I-B轻触开关产品概述

TC-1102-C-I-B是XKB Connectivity(中国星坤)推出的一款小型化直插式轻触开关,针对紧凑空间内的低功率控制需求设计,兼具高可靠性与实用适配性,广泛适用于消费电子、小型家电及工业辅助设备等场景。

一、品牌与产品定位

XKB Connectivity(星坤)作为国内精密电子连接器及开关领域的专业制造商,专注于元器件的可靠性与小型化研发。TC-1102-C-I-B属于其常规高寿命轻触开关系列,核心定位为小尺寸、高耐用性、直插易安装的基础控制开关,满足不同行业对低成本、长寿命轻触元件的需求。

二、核心参数与性能特点

该开关的关键参数与性能特点如下:

  1. 电路与操作特性:电路结构为单刀单掷(SPST),可实现基础通断控制;按钮形状为圆形,操作手感舒适;作用力2.6N(对应260gf),触感清晰且不易误触。
  2. 尺寸与结构:整体尺寸为6mm×6mm×8mm(长×宽×高),属于小型化设计;不带支架,通过直插引脚固定于PCB,节省安装空间;采用铜盖板设计,提升结构稳定性,减少触点晃动。
  3. 电气参数:触点额定电流50mA,额定电压12V,适配低功率信号控制场景;无灯设计,降低功耗,适合电池供电设备。
  4. 寿命与环境:工作寿命达30万次,满足长期频繁操作需求;工作温度范围-30℃~+85℃,覆盖家庭、办公及部分户外环境的温变要求。

三、安装与适配特性

TC-1102-C-I-B采用直插式(插件)安装,适配常规通孔PCB:

  • 引脚样式为PC引脚,兼容波峰焊、手工焊等传统焊接工艺,安装便捷;
  • 6mm×6mm的小型化尺寸,不带支架设计,适合空间受限的设备(如手持遥控器、小型传感器节点);
  • 引脚布局符合行业标准间距,便于电路设计集成,无需额外定制PCB。

四、典型应用场景

结合参数与特性,该开关适用于以下场景:

  1. 手持消费电子:如电视遥控器、智能手环、便携式音频播放器等,小尺寸适配设备紧凑空间,30万次寿命满足日常频繁操作;
  2. 小型家电:如加湿器、桌面小风扇、智能插座等,宽温范围(-30℃~+85℃)适应家电使用环境,直插安装降低生产工艺复杂度;
  3. 工业辅助设备:如小型传感器节点、简单控制面板(如设备启停开关),铜盖板提升触点可靠性,满足工业场景的基本耐用性需求;
  4. 消费电子配件:如耳机线控、充电器指示灯控制开关等,低功耗无灯设计适配电池供电设备,圆形按钮提升操作便捷性。

五、可靠性与环境适应性

该开关的可靠性体现在:

  • 30万次工作寿命,经测试可承受日常频繁操作(如遥控器每天按100次,可稳定使用约8年);
  • 铜盖板结构减少触点接触不良概率,提升电气稳定性;
  • 宽温范围覆盖大部分使用场景,无需额外防护即可适应低温(如北方冬季户外存放)或高温(如厨房环境);
  • 无灯设计避免LED故障风险,进一步提升整体可靠性。

TC-1102-C-I-B凭借小型化、高耐用性、易安装等特点,成为多场景轻触控制的实用选择,适合对成本敏感且追求基础可靠性的电子设备设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.