WMSIC Electronic Components

XKB Connectivity X9555WV-2X08E-PTV01 X9555WV

ModelX9555WV-2X08E-PTV01
PackageDIP
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 180986

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X9555WV-2X08E-PTV01
Type
XKB CONNECTIVITY
Minimum package
500 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X9555WV-2X08E-PTV01
Electronic Component
1
Package
DIP
Electronic Component
2
Electronic Component
IDCInsulation Displacement Connector(Box Header / Box Header)
Electronic Component
2x8P
Electronic Component
2.54mm
Electronic Component
1.734g
Electronic Component
2.54mm
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
BM0265845641
Electronic Component
Through-hole
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X9555WV-2X08E-PTV01 线对板连接器产品概述

X9555WV-2X08E-PTV01是中国星坤(XKB Connectivity)推出的通用型双排直插式线对板针座,属于简牛座系列核心产品,专为电子设备内部电路的信号与低功率电力传输设计,适配2.54mm标准间距PCB布局,兼具可靠性、兼容性与安装便利性。

一、产品核心定位与基本属性

该产品为线对板连接组件,采用双排8Pin(2×08P)结构,180°直插式安装,壳体选用PBT工程塑料并带定位凸台,触头以黄铜为基材表面镀金处理。核心定位是满足工业控制、消费电子、通信终端等领域的常规电路连接需求,可兼容多种线端连接器(如杜邦线、压接端子)匹配使用。

二、关键技术参数详解

(一)电气性能参数

  • 额定电流:3A(AC/DC通用),覆盖多数低功率模块的电力传输需求;
  • 额定电压:250V(AC/DC),符合常规低压电路安全标准;
  • 接触电阻:镀金触头保证接触电阻≤10mΩ,降低信号传输损耗。

(二)机械性能参数

  • 间距/行距:2.54mm(标准间距,适配主流PCB板孔距);
  • 排数与Pin数:2排×8Pin(双排结构提升连接密度,满足多信号并行传输);
  • 安装方式:直插式(180°垂直安装,适配PCB板通孔焊接,无需额外折弯空间);
  • 插拔力:触头插拔力均匀(5~15N),保证连接稳固且操作便捷。

(三)环境适应性参数

  • 工作温度范围:-25℃~+85℃,可适应工业环境的高低温波动;
  • 耐湿性能:壳体PBT材料耐潮,触头镀金抗氧化,适合湿度较大的应用场景;
  • 振动/冲击:符合GB/T 2423振动冲击标准(10~2000Hz振动,10g冲击)。

三、结构设计与材料特性

(一)触头设计:黄铜+镀金双层防护

触头基材选用黄铜(导电性能优异、机械强度高),表面镀纯金(厚度≥0.5μm),具备三大核心优势:

  1. 抗氧化:避免长期使用中触头氧化导致接触不良;
  2. 耐磨损:插拔1000次以上仍保持稳定接触;
  3. 低损耗:接触电阻稳定,减少信号传输中的能量损失。

(二)壳体结构:PBT工程塑料+定位凸台

  • 壳体材料:PBT(聚对苯二甲酸丁二醇酯),具备耐高温(长期使用温度≤120℃)、耐化学腐蚀(抗弱酸碱)、机械强度高的特点;
  • 带凸设计:壳体侧面的定位凸台可辅助PCB板焊接时精准定位,减少安装偏差,提升生产效率。

(三)整体结构:双排直插紧凑布局

双排8Pin结构在有限空间内实现多信号传输,180°直插设计适配常规PCB板通孔,无需复杂的折弯或角度调整,简化设备内部布局。

四、适用场景与应用优势

(一)典型应用场景

  1. 工业控制设备:PLC模块、传感器接口、伺服驱动器的内部连接;
  2. 消费电子:智能家居终端、打印机、小型家电控制板的信号传输;
  3. 通信设备:路由器、交换机、基站辅助模块的电力与信号连接;
  4. 医疗仪器:小型监护设备、诊断仪器的内部低功率电路连接(符合安全规范)。

(二)核心应用优势

  1. 兼容性强:2.54mm标准间距适配绝大多数线端连接器,无需额外定制;
  2. 可靠性高:镀金触头+PBT壳体,长期使用无接触不良、壳体变形问题;
  3. 安装便捷:直插式焊接无需特殊工具,定位凸台提升安装效率;
  4. 成本可控:常规规格设计兼顾性能与性价比,适合批量生产应用。

五、安装与可靠性说明

(一)安装注意事项

  1. PCB板孔距需匹配2.54mm标准,孔直径建议0.8~0.9mm;
  2. 焊接温度控制在260℃以下(持续时间≤3秒),避免损伤PBT壳体;
  3. 线端连接器需与双排8Pin结构匹配,确保触头完全插入(插入深度≥1.5mm)。

(二)可靠性验证

该产品已通过多项行业标准测试:

  • 插拔寿命测试:1000次插拔后接触电阻变化≤5%;
  • 高低温循环测试:-25℃~+85℃循环50次后性能无衰减;
  • 盐雾测试:96小时盐雾试验后触头无明显腐蚀,壳体无开裂。

X9555WV-2X08E-PTV01作为星坤简牛座系列的通用型号,以稳定的性能、标准的规格和便捷的安装,成为电子设备内部连接的优选组件,可满足多数常规电路的信号与电力传输需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.