WMSIC Electronic Components

XKB Connectivity X9821HM-04A-N0HF X9821HM

ModelX9821HM-04A-N0HF
PackageElectronic Component
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X9821HM-04A-N0HF
Type
XKB CONNECTIVITY
Minimum package
2000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X9821HM-04A-N0HF
Electronic Component
1
Package
Electronic Component
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.039g
Electronic Component
1.25mm
Electronic Component
1
Electronic Component
BM0265742900
Electronic Component
PA66
Operating Temperature
25℃~+85℃
Socket
1x4P
Electronic Component
Electronic Component
PIN
4

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X9821HM-04A-N0HF 1.25mm线对板连接器公壳产品概述

一、产品定位与兼容基准

X9821HM-04A-N0HF是XKB Connectivity(星坤)推出的1.25mm间距单排4PIN线对板公端连接器,核心兼容国际品牌Molex 51021系列04PIN公壳(如Molex 51021-0400),专为小型化电子设备的可靠内部连接设计。该产品可实现原有方案的无缝替换,无需调整PCB布局或端子规格,有效降低研发与改造成本。

二、基础结构与规格参数

2.1 机械结构细节

  • 布局形式:采用1排×4PIN(1x4P) 单排插孔设计,结构紧凑,适配小尺寸PCB(最小可兼容10mm×5mm板型);
  • 中心间距:严格遵循1.25mm标准间距,符合行业主流微间距连接器规范,适配现有1.25mm系列端子与母端;
  • 附加结构:无锁扣设计(简化插拔流程,适合频繁维护场景)、无引脚防翅(降低装配复杂度,避免额外加工成本);
  • 端接属性:线对板公壳(板端安装),需与对应母端(线端或板端母壳)配合完成电气连接。

2.2 电气适配性

作为1.25mm间距公壳,其电气参数与Molex 51021系列一致,可适配常规应用的1A/回路电流、50V AC/DC电压需求,满足大多数小型电子设备的信号与低功率传输要求。

三、材料与环境可靠性

3.1 主体材料性能

  • 壳体材质:采用PA66(聚酰胺66) 工程塑料,具备优异的抗冲击性(冲击强度≥60kJ/m²)、耐油性与尺寸稳定性(长期使用变形率≤0.2%),不易因环境变化出现开裂或错位;
  • 阻燃等级:通过UL94V-0 认证,燃烧时可在10秒内自熄,无滴落物,有效降低电子设备火灾风险,符合全球安全规范(如RoHS、REACH)。

3.2 环境适应范围

  • 工作温度:覆盖**-25℃~+85℃** 宽温范围,可稳定工作于低温户外场景(如冬季户外传感器)或高温室内环境(如充电设备);
  • 湿度耐受:可承受相对湿度5%~95%无凝露的环境,适配不同地区的气候条件(如南方高湿、北方低温)。

四、典型应用场景

基于其紧凑结构与可靠性能,该产品广泛应用于:

  1. 消费电子:智能手环、蓝牙耳机、便携式投影仪等小型设备的内部PCB与线材连接;
  2. 物联网终端:环境传感器、智能门锁控制器、小型智能家居节点的信号/电源传输;
  3. 工业微型设备:微型PLC模块、小型仪器仪表(如温湿度计)的内部布线;
  4. 汽车电子(低功耗):车载USB充电模块、仪表盘小屏控制器的辅助连接(非高压高电流场景)。

五、产品核心竞争优势

  1. 高兼容性:1:1匹配Molex 51021系列,端子、母端均可互换,无需修改原有设计,缩短研发周期30%以上;
  2. 紧凑高效:1.25mm超小间距+单排布局,节省PCB空间30%以上,适配当前电子设备“小型化、轻量化”趋势;
  3. 稳定可靠:PA66材料耐温耐冲击,UL94V-0阻燃,宽温范围确保极端环境下的连接稳定性(插拔寿命≥500次);
  4. 装配便捷:无锁扣、无防翅设计,减少装配步骤(无需额外工具),降低人工成本15%,提升生产效率。

六、使用与选型注意事项

  1. 配套选择:需搭配星坤同系列母壳(如X9822HM-04A)或Molex对应母端,以及适配1.25mm间距的端子(如星坤X9811系列端子)使用;
  2. 装配要点:端子插入公壳时需听到“咔哒”声确认到位,避免接触不良;禁止过度插拔(≤10次/分钟)导致壳体变形;
  3. 存储要求:未使用产品需密封存储于温度-10℃+40℃、相对湿度40%60%的环境,避免阳光直射与腐蚀性气体接触,存储周期≤12个月。

该产品凭借高兼容性、紧凑性与可靠性,成为小型电子设备内部连接的优选方案,可满足不同行业对微间距连接器的多样化需求。

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