WMSIC Electronic Components

XKB Connectivity X1321FVS-2X28-C43D48 X1321FVS

ModelX1321FVS-2X28-C43D48
PackageSMD,P=1.27mm
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X1321FVS-2X28-C43D48
Type
XKB CONNECTIVITY
Minimum package
800 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X1321FVS-2X28-C43D48
Electronic Component
4.3mm
Electronic Component
1
Package
SMD,P=1.27mm
Electronic Component
Electronic Component
Electronic Component
Female Header
Electronic Component
1.51g
Electronic Component
1.27mm
Electronic Component
1
Electronic Component
BM0229962911
Electronic Component
Electronic Component
Operating Temperature
40℃~+105℃
Electronic Component
56P
Socket
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X1321FVS-2X28-C43D48 产品概述

X1321FVS-2X28-C43D48 是 XKB Connectivity(中国星坤)推出的一款高密度双排排母,间距为 1.27mm,配置 2×28P 共 56 孔。该产品采用方孔设计与立贴(SMD)封装,顶部插孔方向与 4.3mm 塑高,使其在空间受限的 PCB 布局中能够实现可靠的垂直顶插连接。触头采用黄铜基材并镀金处理,额定电流 1A、额定电压 250V,工作温度范围 -40℃~+105℃,适用于多种通信、消费电子及嵌入式模块互连场景。

一、关键参数

  • 尺寸与间距:2×28P,总孔位 56P,间距 P = 1.27mm
  • 封装与安装:SMD(立贴),顶部插孔方向,塑高 4.3mm
  • 孔型:方孔(便于匹配方形插针或定位)
  • 电气性能:额定电流 1A,额定电压 250V
  • 触头材料与表面:黄铜触头,金属镀金处理(提高接触可靠性与抗氧化能力)
  • 工作温度:-40℃ 至 +105℃

二、结构与材料优势

  • 方孔与双排设计:方孔便于插针定位,双排布置在 1.27mm 间距下实现高密度连接,节省 PCB 面积。
  • 黄铜基体+镀金触点:结合良好的导电性与耐腐蚀性,保证低接触电阻与长期可靠的电气接触。
  • 立贴工艺:适用于现代 SMT 生产线,提高装配效率并便于自动化贴装。

三、典型应用

  • 模块化嵌入式主板与子板互连(顶插连接)
  • 便携式通信设备、测试仪器、消费电子内部连接
  • 工业控制模块、传感器接口及样板验证平台

四、使用与装配建议

  • 焊接工艺:产品为 SMD 封装,兼容常见表面贴装工艺;建议在量产前进行制程验证以优化焊膏用量和回流参数。
  • 插拔与力学:为保证触点寿命,建议按规格表限定插拔次数与插入力;配合合适的插针形状可获得最佳接触效果。
  • PCB 设计:推荐依据 1.27mm 标准间距布置焊盘与过孔,留意焊盘尺寸与锡膏印刷要求以获得稳固焊点。
  • 环境适应:-40℃~+105℃ 的工作温度覆盖典型工业与消费级应用;在高湿或腐蚀性环境可考虑额外防护。

五、包装与定制

  • 常见包装形式为盘带(Tape & Reel)或托盘包装,具体按订单或客户需求提供。
  • 可根据客户需求沟通特殊电镀、键位方向或机械固定方式的定制方案。

X1321FVS-2X28-C43D48 以其高密度排布、可靠的金属接触和 SMD 兼容性,适合对空间与性能有较高要求的产品设计。如需样品、3D/2D 尺寸图或详细技术资料,可联系供应商或我方提供进一步支持。

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