WMSIC Electronic Components

XKB Connectivity X2000WVS-08-6TSN X2000WVS

ModelX2000WVS-08-6TSN
PackageSMT
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 181384

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2000WVS-08-6TSN
Type
XKB CONNECTIVITY
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2000WVS-08-6TSN
Electronic Component
1
Package
SMT
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
1.16g
Electronic Component
2mm
PIN
8P
Electronic Component
1
Electronic Component
BM0265742838
Electronic Component
PA6T
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Pin
1x8P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2000WVS-08-6TSN线对板连接器产品概述

X2000WVS-08-6TSN是**XKB Connectivity(中国星坤)**推出的单排立贴式线对板针座,专为中低功率设备的信号与电源传输设计,兼具紧凑性、可靠性与兼容性,覆盖消费电子、工业控制等多领域应用。

一、产品定位与核心应用场景

该产品定位为紧凑型高可靠板端连接方案,适用于对空间、电流承载平衡要求较高的场景:

  • 消费电子:小家电(咖啡机、加湿器)、便携式设备(移动电源、手持仪器)的内部电源/信号连接;
  • 工业控制:小型PLC、传感器模块、电机控制器的板端接口;
  • 车载辅助:车载显示屏、氛围灯的低压连接(配合车载端子使用);
  • 仪器仪表:万用表、示波器等测试设备的模块间连接。

二、关键参数与设计亮点

1. 结构尺寸参数

  • 引脚配置:1排8Pin(总PIN数8),间距2.0mm——平衡密度与焊接难度,避免过密间距短路风险;
  • 安装方式:SMD立贴封装——无需PCB穿孔,节省背面空间,适配高密度板级布局;
  • 空间适配:Z轴板上高度仅8.8mm——垂直占用极小,兼容薄型设备(如厚度<10mm的便携式产品)。

2. 电气性能参数

  • 电流电压:额定电流3A、额定电压250V——满足5V/3A快充等中低功率需求,支持多路信号同步传输;
  • 温区范围:-25℃~+85℃——覆盖民用与工业级环境温度波动,低温无塑料脆化,高温接触稳定。

三、材质与可靠性保障

1. 触头系统(核心连接)

  • 基体:黄铜(铜锌合金)——导电率高(约40%IACS),降低传输损耗,机械强度优异;
  • 镀层:亮锡(Sn)——焊接性好(适配无铅工艺),抗氧化能力强,避免长期使用后接触电阻增大。

2. 塑料主体(绝缘支撑)

  • 材质:PA6T(聚对苯二甲酰己二胺)——耐温性优于普通PA(长期使用温度≥120℃),尺寸稳定性高(高温变形小);
  • 阻燃等级:UL94V-0——遇火快速自熄(燃烧时间≤10秒),满足安全规范。

四、安装与兼容性优势

1. 生产适配性

SMD立贴封装兼容自动化贴片生产线,贴片机快速定位焊接,生产效率比插针式提升30%+,降低人工虚焊风险。

2. 系统兼容性

  • 间距通用:2.0mm为行业标准,匹配同间距线端连接器(端子线、压接端子),无需额外定制;
  • 布局兼容:8.8mm板上高度避免与相邻元件(电阻、电容)干涉,提升设计灵活性。

五、品牌与品质背书

XKB Connectivity(星坤)是国内连接器领域高新技术企业,该产品通过:

  • 插拔寿命测试:≥500次(接触电阻变化≤10%);
  • 温湿度循环:-25℃~+85℃/95%RH循环100次,性能无衰减;
  • 振动冲击:符合IEC 60068-2-6标准,满足工业级振动环境;
  • 环保认证:符合RoHS指令,无铅无镉,适配国际市场。

综上,X2000WVS-08-6TSN以紧凑设计、可靠性能与通用兼容性,成为中低功率设备板端连接的高性价比选择。

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