WMSIC Electronic Components

XKB Connectivity X1502WRS-10-9TSN X1502WRS

ModelX1502WRS-10-9TSN
PackageSMT
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 181924

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X1502WRS-10-9TSN
Type
XKB CONNECTIVITY
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X1502WRS-10-9TSN
Electronic Component
1
Package
SMT
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.778g
Electronic Component
1.5mm
PIN
10P
Electronic Component
1
Electronic Component
ZH
Electronic Component
BM0265742897
Electronic Component
PA9T
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X1502WRS-10-9TSN 产品概述

一、产品简介

X1502WRS-10-9TSN 是中国星坤(XKB Connectivity)推出的一款 1.50 mm 间距线对板连接器,参考 JST ZH 系列设计,1×10 列卧贴插针结构。该产品以紧凑间距与低矮高度为特征,适用于受空间限制的线束与 PCB 连接场合,可满足信号传输与小功率供电需求。

二、主要参数

  • 插针结构:1×10P(单排 10 针)
  • 间距:1.50 mm(ZH 系列标准间距)
  • 安装方式:卧贴(低剖面/右角贴装)
  • 参考系列:JST ZH
  • 额定电流:1 A(适用于低电流信号与小功率应用)
  • 触头材质:黄铜
  • 触头镀层:镀锡
  • 外壳材质:9T 料(塑料座料号)
  • 品牌:XKB Connectivity(中国星坤)

三、产品特点

  • 小间距、高密度:1.5 mm 间距在保证可靠接触的同时节省 PCB 面积,适合紧凑型电路板布局。
  • 低矮卧贴结构:卧贴设计降低产品整体高度,有利于箱体或面板内空间受限的终端产品。
  • 成本效益高:黄铜基体 + 镀锡触点在保证电气性能的同时成本可控,适合批量应用。
  • 适用性广:基于 ZH 系列标准,便于与常见线端壳体及排线配合使用。

四、典型应用场景

  • 消费类电子(小型家电、遥控器、便携设备)
  • 工业控制与测量模块(信号采集、传感器连接)
  • 物联网与智能硬件(模块间信号线、外设连接)
  • 试验治具与样品机(方便快速插拔的低电流连接)

五、PCB 设计与安装建议

  • PCB 布局时保持插针及周边足够的焊盘空间,保证焊点可靠性与易焊接性。
  • 对卧贴结构,注意元件侧向留空与机械支撑,必要时在 PCB 上增加固定孔或胶点固定线缆应力。
  • 触点为镀锡处理,适合常规波峰或手工焊接工艺;如需回流或高温工艺,请确认外壳 9T 料的耐温性能并与供应商确认工艺兼容性。
  • 线缆端建议加装应力缓冲或热缩管,避免频繁弯折导致焊点或触点疲劳。

六、可靠性与维护要点

  • 额定 1 A 适用于信号及小功率场合,超过额定值时易导致接触发热,应避免超载使用。
  • 镀锡触点在潮湿或强振环境下可能出现氧化或擦拭腐蚀,长期可靠性需求高的场合可考虑更高等级镀层(如镀金)或封装保护。
  • 存储与装配环境应避免强酸强碱或含硫气体,以延长触点寿命与焊接性能。

七、采购与替代建议

  • X1502WRS-10-9TSN 适用于需要与 JST ZH 系列壳体配对的场合,采购时请确认对应的线端壳型号与极数匹配。
  • 若对耐久性或接触电阻有更高要求,可在询价时咨询星坤是否提供其他镀层或强化型产品。
  • 批量采购时建议索取样品进行实装验证,确认 PCB 尺寸、焊接工艺与机械强度满足产品设计要求。

如需进一步的机械尺寸图、PCB 尺寸建议或配对线端壳型号清单,可提供后续资料以便选型与设计验证。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.