Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TS-1102S-B-G-B 是一款出色的轻触开关,具有 6x6x7.0 毫米的紧凑型贴片设计,采用 DIP 封装,适合多种电子电路应用。这款开关由中国知名品牌 XKB Connectivity(中国星坤) 生产,以高可靠性和出色的性能赢得了众多用户的青睐。其 160gf 的按压力设计使得用户在操作时,能够感受到适当的反馈,既不会过于费力,也不会因为过于灵敏而误操作。
紧凑尺寸: TS-1102S-B-G-B 的尺寸为 6x6x7.0 毫米,非常适合空间有限的电子产品设计,帮助设计师在 PCB 设计中节省宝贵的空间。
高可靠性: 该产品采用优质材料制造,适应各种日常使用环境,确保耐用性和长期稳定性。开关的设计经过严苛的测试和验证,满足工业级及消费级产品的可靠性要求。
按压力设计: 160gf 的按压力使得 TS-1102S-B-G-B 在操作时手感恰到好处,无论是用于手持设备的控制,还是工业设备的操作,均能提供良好的用户体验。合理的按压力可以有效减少误触发的可能性,增强设备的操作安全性。
高度可配置性: TS-1102S-B-G-B 开关可以与多种电路配置兼容,用户可以根据自己的需求来选择具体的应用场景。无论是用于电源切换、模式选择还是信号传输,都能游刃有余。
TS-1102S-B-G-B 轻触开关广泛应用于多个行业和产品中,包括但不限于:
TS-1102S-B-G-B 作为一款高品质的轻触开关,凭借其独特的设计和可靠的性能,成为众多电子设计师的首选。无论在消费类电子产品还是在工业设备中,都能提供稳定的操作体验。随着电子行业的不断发展,轻触开关的应用将越来越广泛,而 TS-1102S-B-G-B 的推出正是满足市场需求的重要一步。
对于设计师来说,选择合适的轻触开关是实现产品成功的重要环节,TS-1102S-B-G-B 以其优异的性能、良好的用户反馈,定将为各种电子产品增添色彩。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products