WMSIC Electronic Components

XKB Connectivity X2016WVS-03-9TSW Connector X2016WVS

ModelX2016WVS-03-9TSW
PackageSMT
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 183096

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2016WVS-03-9TSW
Type
XKB CONNECTIVITY
Minimum package
700 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2016WVS-03-9TSW
Electronic Component
1
Package
SMT
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.94g
Electronic Component
2mm
PIN
3P
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0265742968
Electronic Component
PA9T
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2016WVS-03-9TSW 线对板连接器针座产品概述

一、产品定位与兼容特性

X2016WVS-03-9TSW是XKB Connectivity(中国星坤) 推出的2.00mm间距线对板连接器针座,核心兼容JST PH系列标准,专为小型化电子设备的信号与低功率电源传输设计。产品采用立贴(SMD)封装,适配自动化贴装工艺,无需额外适配即可与JST PH系列端子可靠对接,是替代进口同类型产品的高性价比选择。

二、核心规格参数

产品物理与结构参数明确,满足紧凑空间下的连接需求:

  • 插针结构:1排×3PIN(单排3针)
  • 间距:2.00mm(公制标准间距,适配常规PCB布线)
  • 安装方式:立贴式SMD(表面贴装,无需插件孔)
  • 板上安装尺寸:Z轴(板上高度)6.1mm,Y轴(板上底边宽度)7.4mm
  • 总PIN数:3PIN,排数1,每排PIN数3
  • 参考系列:JST PH系列(兼容匹配,电气与机械性能一致)

三、电气性能指标

电气性能稳定可靠,覆盖常规低功率应用场景:

  • 额定电流:2A/回路(满足小功率电源、传感器信号传输需求)
  • 额定电压:100V AC/DC(符合低电压电子设备安全标准)
  • 触头材质:黄铜(高导电率,接触电阻低,减少功率损耗)
  • 触头镀层:雾锡(抗氧化性强,适配无铅焊接工艺,长期使用无接触不良风险)

四、机械结构与安装特性

机械设计适配自动化生产与小型化布局:

  • 立贴封装:直接贴装于PCB表面,节省PCB空间,提升布线灵活性(无需预留插件孔)
  • 触头设计:精密黄铜冲压成型,接触弹性良好,与对应端子插拔配合顺畅,插拔力稳定(无卡顿或过松问题)
  • 尺寸紧凑:板上高度仅6.1mm,底边宽度7.4mm,适配超薄电子设备(如智能手环、小型传感器模块)内部布局

五、材料与可靠性设计

材料选型兼顾耐温、阻燃与机械强度,确保长期稳定:

  • 塑料主体:PA9T(聚酰胺9T),工作温度范围宽(-25℃~+85℃),耐温性优于普通PA66,适配高温回流焊工艺(峰值温度可达260℃)
  • 阻燃等级:UL94V-0(垂直燃烧测试自熄,满足电子设备安全规范,降低火灾风险)
  • 镀层可靠性:雾锡镀层厚度均匀(符合行业标准),抗氧化、抗硫化性能优异,可适应潮湿、多尘等复杂环境

六、典型应用场景

产品因紧凑尺寸、可靠性能,广泛应用于以下领域:

  1. 消费电子:小型智能家居设备(智能开关、温湿度传感器)、便携式音频设备(蓝牙耳机充电盒)、小型手持终端(智能遥控器)
  2. 工业控制:小型PLC模块、传感器节点(压力/流量传感器)、微型执行器的信号连接
  3. 汽车电子:车载小型辅助设备(胎压监测传感器接口、车载USB充电模块)
  4. 通信设备:小型路由器、交换机的内部信号连接(如WiFi模块与主板对接)

X2016WVS-03-9TSW凭借兼容性能、紧凑尺寸与可靠稳定性,成为小型电子设备线对板连接的优选方案,可满足不同行业的常规连接需求。

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