WMSIC Electronic Components

XKB Connectivity X2011HM-15A-N0 Connector X2011HM

ModelX2011HM-15A-N0
PackageElectronic Component
BrandXKB CONNECTIVITY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 183242

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XKB Connectivity X2011HM-15A-N0
Type
XKB CONNECTIVITY
Minimum package
1000 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XKB CONNECTIVITY
Electronic Component
X2011HM-15A-N0
Electronic Component
1
Package
Electronic Component
Electronic Component
1
Electronic Component
(Wire-to-Board / Wire-to-Wire)
Electronic Component
0.618g
Electronic Component
2mm
Electronic Component
1
Electronic Component
BM0265742933
Electronic Component
PA66
Operating Temperature
25℃~+85℃
Socket
1x15P
Electronic Component
Electronic Component
PIN
15

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

X2011HM-15A-N0 2.0mm线对板连接器产品概述

X2011HM-15A-N0是XKB Connectivity(中国星坤) 推出的一款2.0mm间距线对板连接器公端外壳(HSG),针对小型化、高集成度电子设备的连接需求设计,兼顾连接可靠性、安装便捷性与环境适应性,是消费电子、工业控制等领域的实用连接方案。

一、产品核心定位

该产品属于2.0mm线对板连接器系列中的公端组件,采用单排15Pin紧凑布局,带锁扣设计增强连接稳定性,无带翅结构简化安装干涉,主要用于实现导线与PCB板之间的可靠电连接,适配对空间要求严格、需防振动脱落的应用场景。

二、关键规格参数

参数项 具体规格 间距 2.0mm 排数/每排PIN数 1排×15Pin 插孔结构 1×15P(单排15孔) 锁扣设计 带锁扣(防脱) 带翅设计 不带翅(简化安装) 塑料材质 PA66(聚酰胺66) 阻燃等级 UL94V-0(高阻燃) 工作温度范围 -25℃ ~ +85℃ 产品类型 线对板公端外壳(HSG) 品牌 XKB Connectivity(中国星坤)

三、结构设计特点

1. 带锁扣防脱设计

采用卡扣式锁扣结构,与母端连接器对接时可实现** audible click( audible 提示)**,确保连接到位;锁扣提供额外保持力,有效抵抗振动、冲击(如工业设备振动、车载环境晃动)导致的连接脱落,提升系统可靠性。

2. 小间距紧凑布局

2.0mm间距+单排15Pin设计,相比传统3.0mm间距连接器节省约33%的PCB空间,适配小型化设备(如智能穿戴、便携式仪器)的高密度集成需求。

3. 无带翅简化安装

未设置带翅结构,避免与PCB周边元件干涉,同时降低装配难度——无需额外焊接固定带翅,仅需将端子装配至HSG后焊接端子即可,提升生产效率。

4. 高性能塑料外壳

外壳采用PA66材质,兼具高机械强度(耐冲击、抗弯折)与良好耐温性,配合UL94V-0阻燃等级,满足电子设备的安全与可靠性要求。

四、电气与环境性能

1. 电气性能基础

需搭配X2011系列对应公端子使用,典型电气参数参考:

  • 额定电流:1A~3A(依端子线径适配);
  • 额定电压:AC/DC 50V~100V;
  • 接触电阻:≤20mΩ(初始状态);
  • 绝缘电阻:≥1000MΩ(DC 500V)。

2. 环境适应性

  • 温区覆盖:-25℃~+85℃,可适应低温存储、高温工作环境(如车载夏季高温、工业车间温变);
  • 阻燃安全:UL94V-0阻燃等级,燃烧时自熄,降低设备起火风险;
  • 耐候性:具备基本的耐湿热、耐盐雾性能(符合行业通用标准),可应对潮湿、轻度腐蚀环境。

五、典型应用场景

该产品适配多领域小型化电子设备的连接需求,核心应用包括:

  1. 消费电子:智能手环、蓝牙耳机、便携式音箱等小型便携设备的内部连接;
  2. 工业控制:小型PLC模块、传感器节点、微型伺服驱动器的导线与PCB连接;
  3. 汽车电子:车载仪表背光、小功率传感器(如胎压监测子模块)的内部连接;
  4. 通信设备:小型路由器、WiFi模块、IoT网关的接口连接。

六、安装与可靠性说明

1. 安装流程

  1. 将X2011系列公端子(如X2011-T)按规格插入HSG的对应插孔,确认端子卡紧到位;
  2. 将装配好的HSG(带端子)焊接至PCB板的指定焊盘;
  3. 与对应线端母连接器(如X2011W系列)对接,按压至锁扣发出“咔嗒”声,确认连接锁定。

2. 可靠性保障

  • 锁扣设计:重复插拔≥50次后仍保持稳定的保持力;
  • 材质稳定性:PA66外壳耐老化,长期使用无脆化、变形;
  • 环境耐受:经高低温循环、振动测试(符合IEC 60068标准),性能无衰减。

总结:X2011HM-15A-N0以小间距、带锁扣、高阻燃为核心特点,适配多领域小型化设备的连接需求,是一款兼顾性能与成本的实用线对板连接器组件。

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