Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RP2040 microcontroller chip
Dual-core Arm Cortex M0+ processor, flexible clock running up to 133 MHz
264KB of SRAM, and 2MB of on-board Flash memory
USB-C connector, keeps it up to date, easier to use
Castellated module allows soldering direct to carrier boards
USB 1.1 with device and host support
Low-power sleep and dormant modes
Drag-and-drop programming using mass storage over USB
29 × multi-function GPIO pins (20× via edge pinout, others via solder points)
2 × SPI, 2 × I2C, 2 × UART, 4 × 12-bit ADC, 16 × controllable PWM channels
Accurate clock and timer on-chip
Temperature sensor
Accelerated floating-point libraries on-chip
8 × Programmable I/O (PIO) state machines for custom peripheral support
Pinheader Options
C/C++,MicroPython Support
Comprehensive SDK, Dev Resources, Tutorials To Help You Easily Get Started
Dual-Core Arm Processor
Dual-Core Arm Cortex M0+ Processor, Flexible Clock Running Up To 133 MHz
29 × Multi-Function GPIO 
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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