Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Xinglight XL-1005UGC LED XL-1005UGC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Xinglight XL-1005UGC
- Type
- 402
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 80mW
- Electronic Component
- Electronic Component
- Electronic Component
- XINGLIGHT
- Electronic Component
- XL-1005UGC
- Electronic Component
- 1
- Package
- 402
- Electronic Component
- 516nm~531nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.022g
- Electronic Component
- 1
- LED
- 249mcd
- LED
- 120°
- LED
- Electronic Component
- Electronic Component
- BM0224625848
- Electronic Component
- 531nm
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL-1005UGC 0402 翠绿色贴片发光二极管（成兴光）
一、产品概述
XL-1005UGC 为成兴光（Xinglight）出品的一款超微型0402封装翠绿色贴片发光二极管。该器件在典型工作条件下提供明亮、纯净的翠绿色光色，适合对体积和功耗有严格要求的指示与背光场合。小尺寸、正贴（SMD）封装便于自动化贴装和高密度电路设计。
二、主要性能参数
- 发光颜色：翠绿色，峰值波长 525 nm（波长范围 515–535 nm）
- 正向电流：20 mA（典型）
- 正向压降（Vf）：3.3 V（典型）
- 功率：约 70 mW（电功率，IF=20 mA 时近似值）
- 发光强度：900 mcd（典型）
- 发光角度：120°（宽视角）
- 工作温度范围：-20 ℃ ~ +85 ℃
- 封装/载带方式：0402 正贴，透明无色透镜
三、封装与焊接
0402（即 1005 公制）超小体积适合高密度贴片布局，兼容自动贴片与回流焊工艺。建议在设计 PCB 焊盘时参考厂家推荐的焊盘尺寸并保持足够的铜层散热面积，采用无铅回流曲线进行焊接。焊接时避免长时间超温，以保护内部芯片和封装材料。
四、热管理与可靠性
由于体积小，热阻相对较高，应注意热量集中。建议：
- 为 LED 周围留出散热铜箔或热 vias（若工艺允许）；
- 在高环境温度或连续点亮情况下适当降额使用，保证结温在可靠范围内；
- 注意抗静电与防潮处理，储运时遵守防潮、防静电规范。
五、典型应用
- 工业与消费电子指示灯、状态显示
- 仪表盘与键盘背光、微型显示器点阵
- 可穿戴设备与微型传感器指示
- 精密电子设备的色彩提示与局部照明
六、选型与使用注意事项
- 若需更高亮度或更低驱动电流时，请参考亮度-电流曲线并与供应商确认光电特性曲线；
- 长时间高电流驱动会加速衰减，设计时考虑余量；
- 焊接前后避免多次高温循环，拆装操作需使用适合的工具以免损伤封装；
- 严格遵守 ESD 操作规范，防止静电击穿。
七、包装与采购
XL-1005UGC 常见为卷装（Tape & Reel）适配 SMT 生产线，具体包装、最小起订量与交货期请向成兴光或授权分销商咨询确认。购买时建议索取数据手册以获取完整的光电特性曲线与焊盘推荐尺寸图。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
