WMSIC Electronic Components

Xinglight XL-1606UGC LED XL-1606UGC

ModelXL-1606UGC
PackageSMD,1.7x1.1mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1606UGC
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1606UGC
Electronic Component
1
Package
SMD,1.7x1.1mm
Electronic Component
520nm~535nm
Electronic Component
LEDDiode / LED
Electronic Component
0.021g
Electronic Component
1
LED
1.1cd
LED
120°
LED
Electronic Component
Electronic Component
BM0224625885
Electronic Component
525nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1606UGC(0602)翠绿色贴片发光二极管 — 产品概述

一、产品简介

XL-1606UGC 是成兴光(Xinglight)推出的一款高亮度翠绿色侧贴型贴片发光二极管(SMD LED),封装尺寸小巧(1.1 × 1.7 mm),适用于对体积、亮度与角度有综合要求的电子产品指示与背光场合。其典型应用包括状态指示、按键/面板背光、可穿戴设备与物联网终端等。

二、主要技术参数

  • 型号:XL-1606UGC(0602)
  • 封装:SMD,尺寸 1.1 × 1.7 mm
  • 发光颜色:翠绿色
  • 峰值波长:525 nm(典型)
  • 波长范围:520 – 535 nm
  • 正向电流:IF = 20 mA(额定)
  • 正向压降(Vf):3.4 V(典型)
  • 发光强度:1100 mcd(典型,IF=20 mA)
  • 功率:70 mW
  • 发光角度:120°(半值角)
  • 载带方式:侧贴(侧向出光)
  • 透镜颜色:无色透明

三、性能特点

  • 小型化封装,便于高密度布局与微型化设计。
  • 侧贴出光设计,适合侧视指示或边缘发光应用,指示方向性更明确。
  • 高显著亮度(1100 mcd),在20 mA驱动下显示良好可视性。
  • 宽视角(120°)结合侧贴结构,能在较大视角范围内保持可视效果。
  • 透明透镜有利于颜色纯度和光学一致性。

四、典型应用场景

  • 工业与消费类指示灯(面板、按键灯)
  • 可穿戴与小型便携设备状态指示
  • 物联网节点、传感器状态指示
  • 汽车内饰与控制面板(非车外照明)
  • 背光与装饰照明(需注意散热与寿命)

五、驱动与使用建议

  • 建议按额定值驱动(IF = 20 mA),若需延长寿命或降低发热,可采用降额驱动(如10–15 mA)。
  • 简单限流电阻计算示例(以5 V电源为例):R = (VCC − Vf) / IF = (5.0 − 3.4) / 0.02 ≈ 80 Ω。实际设计应考虑容差与电路条件。
  • 支持 PWM 调光,建议调光频率高于几百赫兹以避免可见闪烁;高占空比与快速切换应注意热管理。
  • 侧贴出光对 PCB 布局与指示方向敏感,布置时请以器件出光面为基准。

六、焊接与存储注意事项

  • 建议遵循常见的 SMD 焊接规范(如 JEDEC J-STD-020)进行回流焊接,若使用无铅工艺,请参照制造商推荐的回流曲线;一般峰值温度不超过 260 °C。
  • 器件对湿敏感,若长期暴露于高湿环境,建议在回流前进行预烘烤处理或遵循包装上的湿敏等级(请以出货数据为准)。
  • 装配与测试时应做好静电防护(ESD),避免直接用手触碰引脚与发光窗口。

七、可靠性与注意事项

  • 高温、高电流长期工作会加速光衰与色位漂移,建议在高温环境采用降额驱动或加强散热。
  • 侧贴设计在安装时需确认出光方向与观察角度匹配,避免被金属遮挡或封装遮光。
  • 若对色坐标与光通量有严格要求,请向供应商索取完整的光电特性曲线与批次检测报告。

八、选型与替代

  • 在选择时应综合考虑发光强度、峰值波长、封装尺寸与出光方向。对于需要更低 Vf 或更高亮度的场合,可与厂商沟通定制或选用相近系列产品。
  • 具体的机械尺寸图、焊盘推荐尺寸和电气特性曲线,请以成兴光的正式数据表为准,便于完成 PCB 布局与可靠性验证。

如需该器件的完整数据手册、光学分布图或PCB焊盘建议图,我可以帮您整理或向厂商获取相关资料。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.