WMSIC Electronic Components

Xinglight XL-0201UGC LED XL-0201UGC

ModelXL-0201UGC
Package201
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-0201UGC
Type
XINGLIGHT
Minimum package
5000 圆盘

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-0201UGC
Electronic Component
1
Package
201
Electronic Component
515nm~530nm
Electronic Component
LEDDiode / LED
Electronic Component
0.013g
Electronic Component
1
LED
1.15cd
LED
120°
LED
Electronic Component
Electronic Component
BM0225276572
Electronic Component
525nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-0201UGC — 0201 封装翠绿色贴片发光二极管(成兴光 Xinglight)

一、产品简介

XL-0201UGC 是成兴光(Xinglight)推出的一款超小型 0201 表贴发光二极管,发出翠绿色光,适用于对体积、功耗和视觉效果有严格要求的微型电子产品。封装为超小型 0201(超薄、超小占板面积),便于高密度贴片与轻薄设备应用。

二、主要参数

  • 发光颜色:翠绿色(Peak 525nm)
  • 峰值波长:525nm(范围 515nm ~ 530nm)
  • 正向电流:20 mA(额定)
  • 正向压降 Vf:3.3 V(典型)
  • 发光强度:1150 mcd(典型,详见出厂测试条件)
  • 发光角度:120°
  • 功率:70 mW(额定功耗)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 载带方式:正贴(SMD);封装:0201
  • 品牌:Xinglight(成兴光)

三、特性与优势

  • 极小体积:0201 封装适合极高 PCB 密度和微型化设计。
  • 色域稳定:峰值 525 nm,色位集中,可满足显示与指示的色彩一致性需求。
  • 宽视角:120° 出光角,视野内亮度均匀,便于指示与背光应用。
  • 低功耗高亮度:在额定电流下具有较高的发光强度与合理功耗(Vf×If ≈ 66 mW,与额定 70 mW 匹配)。

四、典型应用

  • 可穿戴设备与微型指示灯(智能手环、耳机)
  • 手机、平板等精密设备的指示与装饰照明
  • 医疗检测仪器、传感器模块的状态指示
  • 细密背光与数码仪表面板点亮

五、驱动与电路建议

  • 建议按额定 20 mA 驱动,若需延长寿命或降低发热可适当降流。
  • 简单限流电阻计算:R = (VCC − Vf) / If。举例:VCC = 5 V,Vf = 3.3 V,If = 20 mA → R ≈ 85 Ω(选用标准 82 Ω 或 91 Ω 并考虑功率)。
  • 若供电接近或低于 Vf(如 3.3 V),请采用恒流驱动或升压方案,避免直接并联驱动导致不稳定发光或损坏。
  • 热管理:在高环境温度或连续点亮场景下,建议降额驱动并保证 PCB 有足够散热路径。

六、焊接、存储与可靠性建议

  • 采用标准 SMT 回流焊流程,具体回流温度曲线请参照厂家数据表和 JEDEC/IPC 规范。
  • 为防潮包装(卷盘密封);长时间储存前如超出保质期或受潮,建议按厂方说明回烘处理。
  • 取放与贴装时注意静电防护(ESD),并确认极性标识与贴装方向。

如需完整电学/光学测试条件、封装尺寸与回流曲线,请提供或索取成兴光官方数据表(Datasheet),以便在设计与量产中做精确匹配与可靠性验证。

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