WMSIC Electronic Components

Xinglight XL-Z1415RGBA-SG LED XL-Z1415RGBA-SG

ModelXL-Z1415RGBA-SG
PackageSMD-4P,1.6x1.5mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-Z1415RGBA-SG
Type
XINGLIGHT
Minimum package
12500 圆盘

Technical parameters

Power
G:70mW;B:70mW;R:50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-Z1415RGBA-SG
Electronic Component
1
Electronic Component
1.6mm
Package
SMD-4P,1.6x1.5mm
Electronic Component
B:460nm~470nm;G:520nm~530nm;R:620nm~630nm
Electronic Component
RGB LED
Electronic Component
0.039g
Electronic Component
1.5mm
Electronic Component
1.5mm
Electronic Component
1
LED
R:200mcd~560mcd;B:130mcd~390mcd;G:600mcd~1500mcd
LED
120°
Electronic Component
BM0259344727

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-Z1415RGBA-SG 贴片发光二极管产品概述

XL-Z1415RGBA-SG是成兴光(Xinglight) 推出的一款微型全彩贴片发光二极管(LED),采用1415规格封装,具备宽视角、高亮度、稳定可靠等核心优势,适用于紧凑空间内的全彩指示、显示及背光场景。

一、产品基本定位与品牌

该产品隶属于成兴光(Xinglight)品牌,聚焦微型贴片LED的研发生产,以1.6×1.5mm超小封装为核心竞争力,集成红(R)、绿(G)、蓝(B)三基色发光单元,实现七彩显示功能,满足小型电子设备对空间紧凑、色彩丰富的需求。

二、核心光学与电学参数

2.1 光学性能

  • 波长范围:红(R)620nm630nm,绿(G)520nm530nm,蓝(B)460nm~470nm,覆盖人眼敏感的三基色光谱;
  • 峰值波长:R 625nm、G 520nm、B 465nm,波长一致性良好,色彩还原度高;
  • 发光强度:R 200mcd560mcd,G 600mcd1500mcd(高亮),B 130mcd~390mcd,适配不同亮度需求场景;
  • 发光角度:120°宽视角,光线覆盖范围广,可视性强。

2.2 电学性能

  • 正向电流(If):三基色单元均为20mA(典型工作电流);
  • 正向压降(Vf):G、B单元2.6V3.2V,R单元1.9V2.3V,电压差小,驱动电路设计简化;
  • 功率(P):G、B单元70mW,R单元50mW,低功耗设计,适合电池供电设备;
  • 抗静电能力:2000V(人体模式),有效降低静电放电(ESD)损坏风险。

三、封装与物理尺寸

  • 封装类型:SMD-4P(表面贴装4引脚),引脚布局适配自动化贴装工艺;
  • 尺寸规格:长1.5mm×宽1.6mm×高1.5mm,属于1415微型封装(行业通用尺寸),可实现高密度贴装,节省PCB空间。

四、可靠性与环境适应性

  • 工作温度范围:-20℃~+85℃,宽温环境下性能稳定,可应用于户外、工业等温差较大场景;
  • 稳定性:通过严格可靠性测试,抗老化、抗振动性能良好,长期使用无明显光衰。

五、典型应用场景

  1. 小型消费电子:智能手环、蓝牙耳机、智能手表的状态指示/呼吸灯;
  2. 小尺寸显示:微型全彩显示屏(如智能眼镜显示、小型仪表显示);
  3. 设备状态指示:路由器、智能家居设备的功能指示灯;
  4. 车载内饰:汽车中控小部件、氛围灯等紧凑空间应用;
  5. 工业控制:小型传感器、控制器的状态反馈指示灯。

XL-Z1415RGBA-SG凭借超小封装、全彩显示、高可靠性等特点,成为紧凑空间全彩LED应用的优选方案,可满足不同行业对微型化、色彩丰富度的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.