WMSIC Electronic Components

Xinglight XL-2835UWC-02 LED XL-2835UWC-02

ModelXL-2835UWC-02
PackageSMD2835-2P
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-2835UWC-02
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
200mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-2835UWC-02
Electronic Component
1
Package
SMD2835-2P
Electronic Component
LEDDiode / LED
Electronic Component
6000K~7500K
Electronic Component
0.037g
Electronic Component
1
LED
120°
LED
Electronic Component
Electronic Component
BM0224625905
Operating Temperature
20℃~+85℃
Current
60mA
Type
2.8mmx3.5mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-2835UWC-02 2835 白色贴片发光二极管 — 产品概述

一、产品简介

XL-2835UWC-02 是成兴光(Xinglight)推出的一款高效白光SMD发光二极管,采用SMD2835标准封装,透镜为黄色(典型黄光荧光粉封装,蓝芯+黄色荧光粉复合以产生白光)。该型号设计用于中高亮度照明应用,在小体积下兼顾光效与散热,适合面板灯、轨道灯、泛光灯、工矿灯及一般室内照明模组等场景。

主要基础参数(规格摘要)

  • 正向电流(If):60 mA(典型/额定值)
  • 最大功率耗散:200 mW
  • 正向压降(Vf):约 3.4 V(在额定电流条件下)
  • 色温(CCT):6000 K ~ 7500 K(冷白光)
  • 发光角度:120°
  • 工作温度范围:-20 ℃ ~ +85 ℃
  • 发光颜色:白色(黄透镜)
  • 载带方式:正贴(卷带/载带包装)
  • 封装:SMD2835

二、光学与色彩特性

  • 色温位于6000–7500K,属于冷白光范畴,偏蓝白,适合需要高显色对比或视觉清晰度的场合(如商业照明、工作场所)。
  • 120°发光角度提供较宽的漫射照明效果,易于实现均匀光场布局,适合面光源与筒灯等应用。
  • 黄色透镜表明使用黄光荧光粉对蓝芯进行波长转换,从而得到白色光。此结构在色温稳定性和制程成熟度上具有优势。

三、电气与热管理要点

  • 在额定正向电流60 mA、Vf≈3.4 V条件下,单颗器件功耗约为0.204 W(I×V ≈ 0.06×3.4),接近所标注的200 mW额定功率。因此实际电流、驱动电压与散热条件需严格控制以避免过热。
  • 推荐在驱动设计中提供合适的恒流源或限流电阻。举例:若采用5 V直流供电并仅驱动单颗LED,则限流电阻约为 R = (Vs - Vf) / If = (5.0 - 3.4) / 0.06 ≈ 27 Ω;功率耗散约 P_R = (Vs - Vf)×If ≈ 0.096 W,选择额定功率更高的电阻以保证可靠性。
  • 热管理建议:尽量将LED焊接在具有良好铜箔散热(大焊盘/热立孔)的PCB上,通过导热路径将热量导入散热体。在高可靠性场合应评估结温(Tc/ Tj)并确保在最大允许工作温度范围内工作。

四、封装与可靠性

  • SMD2835为业界标准片式封装,易于自动贴装与回流焊接,适配常见贴片生产线。载带为正贴方式,便于SMT流程使用。
  • 黄色透镜为荧光粉层,长期高温或过驱动可能导致光通衰减与色温漂移,因此推荐在典型应用中控制结温并避免长时间超额定电流运行。
  • ESD与静电敏感:LED对静电敏感,生产与装配过程中应采取防静电措施(佩戴防静电手环、使用防静电工作台等)。

五、应用场景

  • 面板灯、线条灯和轨道灯:凭借宽发光角与冷白色温,适合商业与办公照明以提高视觉清晰度。
  • 工业与仓储照明:高色温配合高亮度需求,可用于需要较好颜色分辨率的环境。
  • 背光与指示类:在需要冷白色照明或均匀光场的模组中亦可使用。

六、使用与装配建议

  • 焊接:建议遵循通用回流焊工艺,避免局部过热或快速冷却引起的热应力。若使用手工焊接,应控制焊接时间与温度,避免损伤荧光粉层。
  • PCB设计:为降低结温,推荐扩展焊盘面积、增加背面散热铜箔或采用热通孔直通散热层。
  • 存储:避免潮湿环境与强紫外线照射,未装贴的器件应按制造商建议保存(干燥、避光、防静电)。
  • 驱动:优先使用恒流源驱动以稳定光输出并延长寿命。若使用串并联方案,注意匹配器件参数及限流设计。

七、注意事项

  • 请在具体设计中核实器件的详细数据手册(IV曲线、光通量、显色指数、热阻、回流焊曲线等),以便进行精准的热与光性能评估。
  • 避免超过额定If与功耗工作,长期高结温会加速光通衰减与色温漂移。
  • 在批量采购时建议关注binned信息(色温、正向电压分档),以保证整机色一致性。

如需我帮您起草基于该灯珠的常用驱动电路示意、PCB焊盘参考或热设计建议(例如散热铜箔布局与通孔位置建议),可以提供电源电压与模组排列,我可进一步给出计算与示例。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.