WMSIC Electronic Components

Xinglight XL-1005UBC LED XL-1005UBC

ModelXL-1005UBC
Package402
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1005UBC
Type
XINGLIGHT
Minimum package
5000 圆盘

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1005UBC
Electronic Component
1
Package
402
Electronic Component
455nm~475nm
Electronic Component
LEDDiode / LED
Electronic Component
0.021g
Electronic Component
1
LED
240mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0224625894
Electronic Component
465nm
Operating Temperature
20℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1005UBC(0402)产品概述

一、产品简介

XL-1005UBC 是成兴光(Xinglight)推出的一款高亮蓝光贴片发光二极管,0402(1005公制)超小封装,适用于对体积和外观有严格要求的消费电子、背光与指示应用。该器件峰值波长465nm,透镜无色透明,出光均匀,视角宽达120°,兼顾亮度与空间均匀性。

二、主要参数

  • 正向电流(IF):20 mA(典型驱动值)
  • 峰值波长(λp):465 nm(蓝光)
  • 波长范围:455 nm ~ 475 nm
  • 正向压降(Vf):3.3 V(典型)
  • 功率(最大):70 mW
  • 发光强度:240 mcd(在指定驱动下)
  • 发光角度:120°
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:0402(1005,约1.0 mm × 0.5 mm)
  • 透镜颜色:无色透明
  • 贴装方式:正贴(SMD)

三、产品特点

  • 超小封装:0402尺寸有利于高密度贴片组装和微型化产品设计。
  • 高亮度与窄谱:465 nm 峰值提供稳定的蓝色输出,适合对颜色一致性有要求的显示与指示场合。
  • 宽视角:120°大视角在面光或指示灯场景下能获得较好的可视覆盖。
  • 宽工作温度:适应工业级温度范围,可靠性好。
  • 透明透镜:无色透镜减少色偏,利于配合不同光学结构使用。

四、封装与安装建议

  • 建议使用常规回流焊工艺进行贴装,遵循无铅回流曲线规范,避免过高峰值温度及长时间热应力。
  • 0402尺寸对贴装精度要求较高,建议配套优化锡膏印刷模版与取放参数,确保焊点可靠。
  • 焊接后应避免在超出规格的机械冲击或弯曲下工作。
  • 建议在设计PCB时为LED预留合适的焊盘尺寸和散热路径,并考虑遮光/扩散结构以优化出光效果。

五、驱动与热管理

  • 标称驱动电流20 mA,建议根据实际应用和发光寿命需求进行电流降额,长期高电流会加速光衰。
  • 由于封装体积较小,热阻相对较高,在连续点亮或高环境温度下应关注结温,必要时通过PCB铜皮或散热结构降低结温以延长寿命。

六、典型应用

  • 微型指示灯、状态指示与字符背光(仪表、移动设备、可穿戴设备)。
  • 显示与导光条背光单元、图形用户界面点亮。
  • 光学传感阵列与微型照明模块。

七、包装与可靠性提示

  • 建议按厂方包装与储存要求存放,避免潮湿和长时间暴露在高温环境。开卷后按湿敏等级(MSL)控制回流焊时间与干燥处理。
  • 组装与测试时注意ESD防护,防止静电损坏LED芯片。
  • 若需更详细的电学、光学曲线、回流曲线或可靠性数据,请向成兴光索取完整数据手册及相关认证资料,以便于工程验证与生产导入。

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