WMSIC Electronic Components

Xinglight XL-1608UYC-04 LED XL-1608UYC-04

ModelXL-1608UYC-04
Package603
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608UYC-04
Type
XINGLIGHT
Minimum package
4000 编带

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608UYC-04
Electronic Component
1
Package
603
Electronic Component
585nm~595nm
Electronic Component
LEDDiode / LED
Electronic Component
0.021g
Electronic Component
1
LED
210mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0230032108
Electronic Component
590nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608UYC-04(0603)黄色贴片LED — 产品概述

一、产品简介

XL-1608UYC-04 是 Xinglight(成兴光)推出的一款 0603 封装黄色贴片发光二极管,典型峰值波长为 590nm,发光颜色为黄色,透镜为无色透明,视角宽广,适合在空间受限但需均匀照明或指示的电子产品中使用。器件采用正贴(贴装带)供货,便于自动贴装与批量生产。

二、主要性能参数

  • 发光颜色:黄色
  • 波长范围:585 nm ~ 595 nm,峰值波长 590 nm
  • 正向电压(Vf):典型 2.3 V
  • 额定正向电流:20 mA(最大/典型工作点)
  • 功率:50 mW(器件最大耗散能力)
  • 发光强度:210 mcd(典型)
  • 发光角度:120°
  • 透镜颜色:无色透明
  • 封装:0603(1608M)正贴
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 载带方式:正贴(Tape & Reel)

(注:具体测试条件下的数据以出厂数据表为准,上述数值为典型/额定参数概述。)

三、器件特点与优势

  • 小体积:0603 封装适合高密度 PCB 布局与微型化产品设计。
  • 宽视角:120° 大视角保证在较大入射范围内仍有均匀的视觉效果,适合指示与背光应用。
  • 颜色稳定:峰值 590 nm 的黄色光色纯净,适用于状态指示和色彩分级控制。
  • 自动化友好:正贴载带包装,兼容常见贴片机与回流焊工艺,利于大批量生产。
  • 宽工作温度:-40 ℃ 至 +85 ℃,可在一般工业与消费环境中可靠工作。

四、典型应用场景

  • 面板/设备状态指示灯(电源、工作状态等)
  • 仪表、仪器的指示/信号灯
  • 家电与消费电子的视觉提示与照明元件
  • 背光与象征性照明(与其他颜色组合使用)
  • 微型照明模块与示教器件

五、设计与驱动建议

  • 驱动电阻计算:使用恒流或限流电阻驱动为常用简易方案。计算公式 R = (Vsup − Vf) / If。
    例如:当供电 5 V,Vf 2.3 V,目标 If = 20 mA,则 R = (5 − 2.3) / 0.02 = 135 Ω,常用阻值可选 150 Ω 以留有余量。
    若使用 3.3 V 供电,R = (3.3 − 2.3) / 0.02 = 50 Ω。
  • 建议恒流驱动可提升亮度一致性与寿命,特别在串联/并联阵列中更显稳定。
  • 功率与电流:尽量不长期满载 20 mA 工作,建议在可靠性或寿命敏感应用中采用降额运行(如 10–15 mA)以降低热应力并延长使用寿命。
  • 热管理:尽管单颗功耗低,但 0603 尺寸热容量小,建议在 PCB 上为 LED 周围设计足够铜箔散热通道或热沉,避免长期高温运行。

六、封装与焊接建议

  • 推荐使用标准贴片回流焊流程,遵循元器件与无铅回流焊规范(例如 J-STD-020)进行温度曲线控制,避免超过器件允许的峰值温度。
  • 回流次数与温度控制:建议按 PCB 工艺要求控制回流峰值与时间,必要时参考供应商数据表中的具体焊接曲线。
  • 焊盘设计:依据 0603 标准封装设计合理焊盘、焊膏量与焊盘间距,避免焊锡桥或偏位。
  • 取放与贴装:自动贴装时注意吸嘴与取放力,避免对器件施加过大机械应力。

七、存储、可靠性与注意事项

  • 存储环境:干燥、常温、避免阳光直射与潮湿环境,长时间存放建议密封防潮包装。
  • ESD 保护:LED 对静电敏感,建议在生产与测试过程中采取接地、戴手环、使用防静电工作台等防护措施。
  • 使用注意:避免在超过额定电流与温度的条件下长期工作;如需在高温环境使用,应进行降额设计并验证寿命。
  • 检测建议:在产品设计阶段进行光学一致性、驱动电流与热循环等可靠性验证,确保整机性能稳定。

如需完整电气光学数据表、典型IV/光强曲线、推荐焊盘尺寸和包装信息(Tape & Reel 数量),建议向 Xinglight(成兴光)索取官方数据表以获得详细规范和生产使用限制。

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