WMSIC Electronic Components

Xinglight XL-3216UGC-FB LED XL-3216UGC-FB

ModelXL-3216UGC-FB
Package1206
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-3216UGC-FB
Type
XINGLIGHT
Minimum package
3000 圆盘

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-3216UGC-FB
Electronic Component
1
Package
1206
Electronic Component
515nm~535nm
Electronic Component
LEDDiode / LED
Electronic Component
0.028g
Electronic Component
1
LED
900mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0225276571
Electronic Component
525nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-3216UGC-FB — 1206 翠绿色贴片发光二极管产品概述

一、产品简介

XL-3216UGC-FB 是成兴光(Xinglight)推出的一款1206封装翠绿色贴片发光二极管,峰值波长525nm,典型发光颜色为明亮的翠绿色。该器件采用反贴(背面焊盘)载带方式设计,适用于高密度表面贴装(SMT)工艺与自动化贴装线。

二、主要特性

  • 正向电流(If):20 mA(典型驱动值,长期使用建议降额)
  • 峰值波长(λp):525 nm,波长范围 515–535 nm
  • 发光角度:120°
  • 发光强度:900 mcd(典型值)
  • 功率:70 mW(最大耗散/分类依据)
  • 正向压降(Vf):3.4 V(典型)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 封装:1206 SMD,载带方式:反贴 这些参数使其在可视指示、背光、信号指示及装饰照明等应用中具有良好的亮度和色彩表现。

三、封装与焊接建议

1206 标准封装,反贴设计利于底部焊盘焊接。建议采用无铅回流焊工艺,遵循厂家推荐的回流温度曲线,避免长时间高温暴露以防光衰与封装变形。焊接时注意焊膏用量与焊盘设计,保证良好散热并避免翘曲。

四、驱动与热管理

  • 建议工作电流不超过20 mA,若要求更长寿命或更低光衰,建议在实际应用中按10–15 mA降额使用。
  • 按典型Vf 3.4 V计算限流电阻:R = (Vcc - Vf) / If。例:Vcc=5V、If=20mA,则R≈80 Ω(取标准阻值并留一定余量)。
  • 尽量保证良好散热路径,PCB上增加散热铜箔或与地/电源平面相连以降低结温,从而提升可靠性与寿命。

五、可靠性与储存

器件工作温度范围宽,可适应大多数室内与户外环境。储存时避免潮湿与高温,建议在干燥箱(<40% RH)中密封保存,开盘后尽快使用并按MSL等级执行回流焊前的预烘烤要求。注意静电防护(ESD)措施,避免击穿PN结。

六、典型应用场景

  • 仪表面板与指示灯
  • 电子消费品与家电指示
  • 背光与装饰照明
  • 信号标识与状态提示

本产品以高亮度、宽视角与稳定的色域表现为特点,适合需要清晰翠绿色视觉提示的场合。若需更详细的机械尺寸图、光电曲线(IV、IV-T、光强角度分布)或封装资料,请提供联系方式以便索取完整Datasheet。

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