WMSIC Electronic Components

Xinglight XL-1608UOC-06 LED XL-1608UOC-06

ModelXL-1608UOC-06
Package603
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608UOC-06
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608UOC-06
Electronic Component
1
Package
603
Electronic Component
600nm~610nm
Electronic Component
LEDDiode / LED
Electronic Component
0.022g
Electronic Component
1
LED
315mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0224625864
Electronic Component
605nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608UOC-06 0603 橙色贴片发光二极管 — 产品概述

一、产品简介

XL-1608UOC-06 是成兴光(Xinglight)推出的一款微型贴片发光二极管(SMD LED),封装尺寸为0603(公制1608),发光颜色为橙色。该器件在典型工作电流下具有良好的亮度表现和较宽的视角,适合体积受限的指示与背光应用。

二、主要参数

  • 型号:XL-1608UOC-06
  • 品牌:Xinglight(成兴光)
  • 封装:0603(1608公制)正贴(SMT)
  • 发光颜色:橙色
  • 峰值波长:605 nm(典型)
  • 光谱范围:600–610 nm
  • 正向电流:20 mA(最大/典型驱动条件)
  • 正向压降 (Vf):2.3 V(典型)
  • 发光强度:315 mcd(在指定测试条件下)
  • 发光角度:120°
  • 功率:50 mW(最大功耗)
  • 工作温度:-40 ℃ 至 +85 ℃
  • 透镜:无色透明透镜

三、产品特性与优势

  • 超小体积(0603),适合高密度贴片电路与微型化产品设计。
  • 峰值波长605 nm,呈标准橙色,颜色一致性好,适合指示与视觉提示。
  • 宽阔视角(120°),视觉覆盖面大,有助于提高可见性而不需精确对准。
  • 低正向压降(典型2.3 V),便于与常见电源配合。
  • 适应较宽的工作温度范围(-40 ℃ 至 +85 ℃),可靠性符合一般工业级应用需求。
  • 透明无色透镜可呈现纯色光输出,适合需要高色彩还原的场景。

四、典型应用场景

  • 指示灯与状态指示(消费电子、家电、仪器仪表)。
  • 背光与局部照明(键盘、仪表盘面板)。
  • 可穿戴设备与移动终端中的状态提示。
  • 小型电子玩具、遥控器及信号指示电路。
  • 需要高密度封装的工业与商业电子产品。

五、设计与使用建议

  • 驱动方式:建议恒流驱动或在限流电阻的配合下使用。典型限流电阻计算(以5 V电源为例): R = (Vsupply − Vf) / I ≈ (5.0 − 2.3) / 0.02 ≈ 135 Ω,可选150 Ω标准阻值。
  • 可靠性与寿命:如需延长寿命与降低发热,可将工作电流下调(例如10–15 mA)以减少光衰并提高可靠性。
  • 调光控制:支持PWM调光与恒流调光;PWM频率选择应避免可见闪烁(一般>200 Hz)。
  • 热管理:虽为低功耗器件,但在高密度布板或高环境温度下需关注功耗累积与散热,避免长时间接近最大功率工作。
  • 焊接与回流:建议按照IPC/JEDEC推荐的贴片回流温度曲线进行工艺控制,避免超温或超时导致可靠性下降。
  • 防静电与防潮:在存储与加工中注意ESD防护和湿敏处理,遵循元件包装上的防潮等级与回流前的烘烤要求(如适用)。

六、包装与订购信息

  • 标准封装形式为贴带盘带(Tape & Reel),便于SMT自动贴装。
  • 订购时请注明型号:XL-1608UOC-06;并与供应商确认最小起订量、包装方式与交期。
  • 如需更详细的电气特性曲线、光谱分布图、回流曲线或可靠性测试报告,建议向成兴光(Xinglight)索取完整的数据手册与检验证书。

如需我根据您的电源、电路板布局或具体应用场景计算限流元件、给出样板电路或回流建议,请提供电源电压、目标亮度或PCB热环境等信息,我可以给出更具体的设计方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.