WMSIC Electronic Components

Xinglight XL-3227SURUGC LED XL-3227SURUGC

ModelXL-3227SURUGC
PackageSMD-4P,3.2x2.7mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-3227SURUGC
Type
XINGLIGHT
Minimum package
3000 圆盘

Technical parameters

Power
70mW;50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-3227SURUGC
Electronic Component
1
Package
SMD-4P,3.2x2.7mm
Electronic Component
520nm~530nm;620nm~630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.037g
Electronic Component
1
LED
78mcd;280mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0225196503
Electronic Component
625nm;525nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-3227SURUGC 产品概述

一、产品简介

XL-3227SURUGC 是成兴光(Xinglight)推出的一款 1210 封装贴片发光二极管(SMD LED),采用共阳极配置,透明无色透镜,发光角度约 120°。该器件针对指示、背光和面板显示等应用进行了优化,具有良好的光学均匀性和可靠的电气特性,适合自动贴装与回流焊工艺。

二、主要电学与光学参数

  • 封装:1210(3.2 × 2.5 mm)贴片封装
  • 配置:共阳极(Common Anode)
  • 额定正向电流(If):20 mA
  • 发光角度:120°
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 透镜颜色:无色透明
  • 发光颜色:红色、翠绿色(双色款)

颜色与典型参数(在 If = 20 mA 下):

  • 翠绿色(峰值 525 nm,波长范围 520–530 nm):峰值波长 525 nm,正向压降 Vf ≈ 3.4 V,典型光强 ≈ 280 mcd,最大功耗 ≈ 70 mW。
  • 红色(峰值 625 nm,波长范围 620–630 nm):峰值波长 625 nm,正向压降 Vf ≈ 2.4 V,典型光强 ≈ 78 mcd,最大功耗 ≈ 50 mW。

(以上参数为典型值,实际选型应参考厂家完整数据手册的典型/最大值与曲线图。)

三、封装与安装建议

  • 建议采用标准 SMD 贴片工艺,支持自动化贴装与回流焊。
  • 回流焊温度曲线应遵循器件承受能力与厂家推荐的回流规范;通常遵循 JEDEC/IPC 的 SMD 回流曲线,峰值温度与时间要与 PCB 和其他元件相匹配。
  • 共阳极使用时,通常将公共引脚接至正电源(V+),每个发光引脚通过限流电阻与接地(或驱动器)串联以控制电流与亮度。限流电阻可放在阳极或阴极侧,但每个颜色通道需独立限流。

示例限流计算(供参考):

  • 以 5 V 电源驱动翠绿色(Vf ≈ 3.4 V):R = (5.0 − 3.4) / 0.02 ≈ 80 Ω,取常用 82 Ω。
  • 以 5 V 电源驱动红色(Vf ≈ 2.4 V):R = (5.0 − 2.4) / 0.02 ≈ 130 Ω,取 130 Ω 或 150 Ω 近似值。

四、可靠性与注意事项

  • 工作环境温度范围宽(-40 ℃ ~ +85 ℃),适合工业级应用。长期稳定性与光通衰减受工作电流、结温与驱动方式影响,建议在实际应用中留有余量并做好散热设计。
  • 避免静电放电(ESD)损伤,生产与运输过程中采用 ESD 防护措施。
  • 对于高发光效率与长寿命要求的场合,建议在样品评估阶段做加速应力测试(高温、湿热、循环老化)以验证可靠性。

五、典型应用

  • 仪器仪表与指示灯(工业控制面板、交通设备)
  • 消费电子指示与状态显示(遥控器、家用电器)
  • 背光与符号照明(键盘背光、标识灯)
  • 车用辅助指示(在满足车规认证下)

六、选型要点与采购建议

在选购时,请确认所需颜色、光强等级与封装形式是否与 XL-3227SURUGC 的规格一致;如需进行批量采购,建议索取并核对完整数据手册(IV 曲线、光强分布、热阻、回流焊工艺参数)以及样品进行实际评估。对于特殊环境(如高温、高湿或车规)请向厂商确认额外认证与测试报告。

总结:XL-3227SURUGC 以 1210 小尺寸封装、共阳极设计及较宽的工作温度范围为特点,适合要求自动贴片与可靠指示照明的应用场景。实际设计时应根据 Vf、If 与视在光强选择合适限流与驱动方案,以确保长期稳定运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.