WMSIC Electronic Components

Xinglight XL-1608SURUGC LED XL-1608SURUGC

ModelXL-1608SURUGC
PackageSMD-4P,1.6x0.8mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608SURUGC
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
50mW;70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608SURUGC
Electronic Component
1
Package
SMD-4P,1.6x0.8mm
Electronic Component
520nm~530nm;620nm~630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.02g
Electronic Component
1
LED
150mcd;550mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0225276027
Electronic Component
525nm;630nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608SURUGC 0603 产品概述

一、产品简介

XL-1608SURUGC(0603)是成兴光(Xinglight)推出的一款贴片发光二极管,适用于微型指示与背光场合。0603(1608公制)小尺寸封装结合无色透明透镜,提供红色与翠绿色两种发光颜色,具有宽发光角度与稳定的电光特性,便于自动贴装与大批量生产应用。

二、主要性能参数

  • 正向电流(IF):20 mA(典型驱动值)
  • 发光颜色 / 峰值波长:
    • 翠绿色:520–530 nm(峰值 525 nm)
    • 红色:620–630 nm(峰值 630 nm)
  • 正向压降(Vf):
    • 红色:1.8 V ~ 2.6 V
    • 翠绿色:2.8 V ~ 3.5 V
  • 功率耗散:
    • 红色:≈50 mW
    • 翠绿色:≈70 mW
  • 发光强度(Iv):
    • 红色:约 150 mcd
    • 翠绿色:约 550 mcd
  • 发光角度:120°
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装:0603(1608公制),贴片(SMT)
  • 透镜:无色透明

注:上述为典型参数范围,实际元件请参照出厂数据手册与出货检验数据。

三、封装与外观

0603小尺寸封装(约1.6 × 0.8 mm),适合高密度PCB布局与自动贴装。无色透明透镜利于宽角出光与颜色还原。载带方式为正贴(SMT tape & reel),便于SMT生产线直接上料。

四、驱动与热管理

  • 推荐驱动:单颗常用恒流驱动或限流电阻驱动。典型驱动电流为20 mA;为延长寿命与降低热量,可在低于20 mA的电流下工作(例如 5–15 mA)。
  • 限流电阻计算示例:R = (Vcc − Vf) / If。
    • 以 Vcc = 5 V 驱动翠绿色(取 Vf=3.0 V, If=20 mA):R ≈ (5 − 3.0)/0.02 = 100 Ω
    • 以 Vcc = 3.3 V 驱动红色(取 Vf=2.0 V, If=20 mA):R ≈ (3.3 − 2.0)/0.02 = 65 Ω
  • 热管理:0603 封装热阻相对较大,长时间高流驱动时注意PCB散热与间距,避免器件过热影响亮度与寿命。

五、焊接与可靠性建议

  • 焊接:建议遵循无铅回流焊工艺,峰值温度不超过行业规范(参考 JEDEC/IPC 建议)。回流曲线应控制升温速率与保温时间,避免超温或长时间高温。
  • 防静电:LED易受静电破坏,生产与测试过程中应做好ESD保护(佩戴防静电腕带、使用防静电台面及接地设备)。
  • 存储与处理:避免潮湿环境,长期存放建议密封防潮包装并按MSL等级处理;贴片前若有潮解风险,按厂商建议预烘烤处理。
  • 可靠性测试建议:常见寿命、温度循环、浸锡性与振动测试,以确认产品在目标应用环境中的稳定性。

六、典型应用场景

  • 消费电子指示灯(手机、遥控器、家电面板)
  • 仪表与信号指示
  • 背光与键盘灯
  • 可穿戴设备与微型显示模块
  • 状态指示与装饰照明

七、选型与注意事项

  • 选色时注意峰值波长与显色偏好,工程上常以峰值波长与色坐标为准。
  • 若需更高亮度或更长寿命,请考虑降低驱动电流或采用热性能更好的封装/散热设计。
  • 如用于汽车或工业严苛环境,请与供应商确认是否满足相应认证与温度/震动要求。

如需完整数据手册(光电曲线、相对强度、IV曲线、封装尺寸图及回流焊建议曲线)或样品支持,请联系成兴光(Xinglight)或指定经销渠道获取详细技术资料。

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