Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Xinglight XL-2012SURUGC LED XL-2012SURUGC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Xinglight XL-2012SURUGC
- Type
- XINGLIGHT
- Minimum package
- 3000 圆盘
Technical parameters
- Power
- 70mW；50mW
- Electronic Component
- Electronic Component
- Electronic Component
- XINGLIGHT
- Electronic Component
- XL-2012SURUGC
- Electronic Component
- 1
- Package
- 805
- Electronic Component
- 620nm~630nm；520nm~530nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.026g
- Electronic Component
- 1
- LED
- 800mcd；300mcd
- LED
- 120°
- LED
- Electronic Component
- Electronic Component
- BM0225276570
- Electronic Component
- 530nm；620nm
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL-2012SURUGC 0805 贴片发光二极管（红 / 翠绿）产品概述
一、产品简介
XL-2012SURUGC 为 Xinglight（成兴光）推出的0805封装双色贴片LED，采用共阳极（共阳）配置，红色与翠绿色二色共存于同一器件，透明无色透镜，发光角度宽达120°，适合面板指示、状态显示与紧凑型背光应用。
二、主要性能指标
- 封装：0805（约2.0 × 1.25 mm）
- 配置：共阳极（单阳两阴）
- 正向电流：If = 20 mA（最大额定）
- 峰值波长：红 620 nm；翠绿 530 nm
- 波长范围：红 620–630 nm；翠绿 520–530 nm
- 正向压降：红 Vf ≈ 2.4 V；翠绿 Vf ≈ 3.4 V
- 发光强度（典型）：翠绿 800 mcd；红 300 mcd
- 功率（近似）：红 ≈ 50 mW（2.4V×20mA）；翠绿 ≈ 70 mW（3.4V×20mA）
- 发光角度：120°
- 工作温度：-40 ℃ ～ +85 ℃
- 载带方式：正贴（Tape & Reel）
- 透镜：无色透明
三、电气与光学特性说明
器件为共阳极设计，便于在单电源系统中通过独立的下拉/低端开关或驱动器来控制两色。驱动与限流建议：
- 电阻计算示例（VCC=5V）：红 R≈(5−2.4)/0.02=130Ω；翠绿 R≈(5−3.4)/0.02=80Ω。实际取值可酌情增大以延长寿命或调整亮度。
- 建议工作电流在10–20 mA之间做电流降额以提高可靠性与一致性。
四、封装、装配与焊接建议
0805小尺寸适合高密度贴装。推荐回流焊工艺：
- 预热：150–180 ℃，60–120 s；峰值温度不超过 260 ℃，峰值维持时间 10–30 s。
- 建议遵循IC厂商通用回流曲线，避免超过温度极限及多次回流。
- 存储于干燥箱中（相对湿度＜30%），开封后建议在规定时间内贴装焊接以避免吸湿造成焊接缺陷。
五、应用场景
- 仪表面板与指示灯、通信设备指示、家电状态显示、消费电子小型指示与图形背光等领域，适用于对体积和多色显示有要求的场合。
六、可靠性与注意事项
- 建议在设计时考虑ESD防护（建议佩戴防静电措施，器件ESD敏感）。
- 长期高温或过流会加速光衰，必要时做额定电流降额。
- 由于为共阳设计，PCB布局需合理安排公共阳极与各色阴极的走线与阻抗匹配，避免热集聚影响一致性。
如需详细的光电曲线、回流温度曲线或封装图纸（3D/尺寸图）、老化筛选标准，请告知具体用途与批量需求，我可协助提供进一步的工程资料与选型建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
