WMSIC Electronic Components

Xinglight XL-3030WWC-1W-6V LED XL-3030WWC-1W-6V

ModelXL-3030WWC-1W-6V
PackageSMD3030-2P
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-3030WWC-1W-6V
Type
XINGLIGHT
Minimum package
5000 圆盘

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-3030WWC-1W-6V
Electronic Component
1
Package
SMD3030-2P
Electronic Component
LEDDiode / LED
Electronic Component
2800K~3200K
Electronic Component
0.036g
Electronic Component
1
LED
100mcd~130mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0259344339
Operating Temperature
20℃~+85℃
Current
150mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-3030WWC-1W-6V 3030封装暖白贴片LED产品概述

一、产品定位与核心价值

XL-3030WWC-1W-6V是成兴光(Xinglight)针对中低功率暖光照明场景推出的3030封装贴片LED,核心聚焦“高可靠、易集成、广覆盖”三大需求。其暖白色温(2800K-3200K)契合温馨氛围营造,6.4V正向压降适配窄电压驱动电路,120°宽发光角度无需额外透镜即可覆盖大面积,宽温工作范围(-20℃~+85℃)适应厨房、仓库等温差场景,是室内照明、商业展示等领域的高性价比选型。

二、关键参数深度解析

1. 电性能参数

  • 功率与电流匹配:额定功率1W,正向电流(If)额定值150mA(由P=Vf×If推导,6.4V×0.15A≈0.96W,接近额定功率,驱动匹配性强);
  • 正向压降:典型值6.4V,比常规5V暖白LED略高,可减少驱动电路分压损耗,适配6-7V输出的恒流源;
  • 反向耐压:常规≥5V(需参考官方 datasheet 确认,避免反向过压损坏)。

2. 光性能参数

  • 色温与光色:2800K-3200K暖白区间,配合黄色透镜优化光色一致性(减少色偏),出光柔和不刺眼;
  • 发光角度:120°宽角输出,覆盖范围广,适合走廊、卧室等需要大面积照明的场景;
  • 光通量:结合1W功率与暖白LED常规光效(80-100lm/W),典型光通量≈80-100lm(具体值需参考批次 datasheet)。

3. 机械与环境参数

  • 封装尺寸:3030标准封装(3.0mm×3.0mm×0.8mm),节省PCB空间,兼容主流SMT贴装设备;
  • 载带方式:正贴包装(2500-5000pcs/卷),支持高速自动化生产,提升产线效率;
  • 工作温度:-20℃~+85℃,通过高低温循环测试,低温无明显光衰,高温下长期工作稳定。

三、封装与可靠性设计亮点

1. 散热与封装结构

采用高导热陶瓷/金属基板(常规3030封装主流设计),1W功率下可快速导出热量,避免芯片结温过高;独立二极管配置(单芯片封装),无串并联失效风险,单点故障不影响整体。

2. 透镜与光效优化

黄色硅胶透镜配合暖白芯片,既提升光色一致性,又减少光损失;透镜耐高温(长期工作≤100℃),无发黄、脱胶问题,寿命≥5万小时(常规3030 LED标准)。

3. 宽温适配性

芯片与封装材料经过高低温匹配测试,-20℃时光衰≤5%,+85℃时结温控制在120℃以内(安全结温≤150℃),适合温差较大的应用场景。

四、典型应用场景

  1. 室内照明:卧室吸顶灯、走廊筒灯、台灯(暖白氛围+120°宽角,覆盖范围广);
  2. 商业展示:货架灯、橱窗灯(暖白凸显商品质感,1W功率节能);
  3. 小功率背光:收银机、工控屏等小型显示屏背光(正贴封装易集成);
  4. 应急照明:小型应急灯(宽温工作,低功耗);
  5. 景观装饰:室内绿植灯、墙面洗墙灯(暖白营造温馨感,宽角覆盖墙面)。

五、选型与使用注意事项

  1. 驱动匹配:必须用恒流驱动(禁止恒压),输出电流150mA±5%,电压6-7V;过流(>180mA)会导致光衰加速、寿命缩短;
  2. 散热设计:PCB焊盘下方需铺铜(面积≥10mm²),环境温度>60℃时降额使用(电流≤120mA);
  3. 焊接工艺:回流焊峰值温度≤250℃(时间≤10s),手工焊温度≤350℃(时间≤3s),禁止烙铁接触透镜;
  4. 光色一致性:同一应用选同一批次产品(色温偏差≤100K),避免视觉色偏;
  5. 环境防护:避免直接接触水、油污,室内使用为主;户外短期使用需加IP65防水外壳。

该产品平衡了性能、成本与可靠性,是中低功率暖光照明领域的实用选型,可满足多数室内场景的照明需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.