WMSIC Electronic Components

Xinglight XL-1608IRC940 LED XL-1608IRC940

ModelXL-1608IRC940
Package603
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608IRC940
Type
XINGLIGHT
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608IRC940
Electronic Component
1
Package
603
Electronic Component
935nm~946nm
Electronic Component
Infrared Emitter
Electronic Component
140°
Electronic Component
0.01g
Electronic Component
1
Electronic Component
BM0259344349
Operating Temperature
40℃~+85℃
Current
30mA
Electronic Component
2mW/sr
(Vf)
1.2V~1.5V
Power Dissipation(Pd)
45mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608IRC940 产品概述

一 产品简介

XL-1608IRC940 为成兴光(Xinglight)推出的微型红外发射二极管,采用603/0603贴片封装,面向体积受限且对红外照射要求较高的消费电子与工业应用。器件峰值波长约 940nm(工作范围 935nm–946nm),对常见的近红外接收器和CMOS/CCD成像器件有良好匹配,光谱不可见于人眼,适合夜间或隐蔽照明与信号传输。

二 主要规格

  • 峰值波长:935nm–946nm(典型 940nm)
  • 正向压降 Vf:1.2V–1.5V
  • 正向电流 If(最大):30mA(建议连续工作电流按降额使用)
  • 辐射强度:2 mW/sr(典型)
  • 视角:140°(半功率角,广角发射)
  • 功率耗散 Pd:45 mW
  • 反向耐压 Vr:5V
  • 工作温度:-40℃ 至 +85℃
  • 封装:603(0603,约 1.6 × 0.8 mm)

三 特性与优势

  • 小体积低成本:603 封装便于高密度贴装,适合轻薄设备与空间受限的 PCB 布局。
  • 宽视角覆盖:140° 大视角可减少对阵列排布的需求,简化光学设计。
  • 与常见红外接收器匹配良好:940nm 波段是行业通用的遥控与通信波长。
  • 耐温范围广:适合室温及工业级温度环境。
  • 可靠性:成兴光生产控制与筛选流程保证一致性,适合集成化量产使用。

四 典型应用

  • 遥控器与红外通信链路
  • 夜视/监控补光(配合图像传感器)
  • 距离/接近传感器与手势识别发射端
  • 汽车内饰/智能家居红外感应系统
  • 可穿戴与物联网设备中的不可见指示/通信

五 使用与焊接建议

  • 驱动:建议串联限流电阻 R = (Vcc − Vf) / If;示例:3.3V 供电、20mA 驱动时 R ≈ 100Ω。
  • 降额:建议连续工作电流低于最大额定(如 10–20mA)以延长寿命与降低热积累。
  • 回流焊:遵循无铅回流曲线,避免超过器件最高结温,控制峰值温度与保温时间;建议预热与缓冷。
  • 防静电与清洗:属于半导体器件,推荐 ESD 防护(HBM 感应),清洗时避免强烈溶剂与长时间超声。
  • 极性识别:贴片封装需在 PCB 丝印与封装短脚/凹陷处明确标注阳极/阴极方向以免贴装错误。

六 包装与可靠性

  • 常用包装形式为卷带(Tape & Reel),便于贴片机直接贴装。
  • 符合 RoHS 环保无铅制造工艺。
  • 在设计中应考虑热管理与电流降额策略以保证长期光衰与发光一致性。

如需样片、详细光电曲线(IV、光强–电流、波长分布)或封装尺寸图,请提供采购数量与用途以便成兴光提供更完整的技术资料与应用支持。

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