Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Xinglight XL-3210UGC LED XL-3210UGC
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Xinglight XL-3210UGC
- Type
- XINGLIGHT
- Minimum package
- 3000 编带
Technical parameters
- Power
- 70mW
- Electronic Component
- Electronic Component
- Electronic Component
- XINGLIGHT
- Electronic Component
- XL-3210UGC
- Electronic Component
- 1
- Package
- SMD-3P,3.2x1.5mm
- Electronic Component
- 517.5nm~525nm
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 0.029g
- Electronic Component
- 1
- LED
- 1.45cd
- LED
- 120°
- LED
- Electronic Component
- Electronic Component
- BM0228060424
- Electronic Component
- 535nm
- Operating Temperature
- 40℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL-3210UGC（1204）翠绿色贴片LED 产品概述
一、产品简介
XL-3210UGC 为 Xinglight（成兴光）推出的一款高亮度翠绿色贴片发光二极管，封装为 SMD 1.5 × 3.2 mm（1204）。器件采用无色透明透镜、侧贴载带方式，视角宽达 120°，适用于要求均匀出光与可视角度较大的照明与指示场合。
二、主要电学与光学参数
- 发光颜色：翠绿色
- 发射波长：517.5 nm ～ 525 nm（峰值波长标注 535 nm）
- 正向电压 Vf：2.7 V ～ 3.3 V（典型值按出厂标注参照）
- 额定电流 If：20 mA
- 功率：70 mW（器件最大耗散，依实际工作点核算）
- 发光强度：约 1450 mcd（在 20 mA 测试条件下）
- 发光角度：120°
- 透镜颜色：无色透明透镜
三、封装与机械特性
- 封装类型：SMD（1.5 × 3.2 mm）
- 载带方式：侧贴（便于低矮外观或侧发光设计）
- 工作温度范围：-40 ℃ ～ +85 ℃，适合工业级环境
- 建议采用卷带盘装（Tape & Reel）方式供货，利于贴片生产线直接贴装
四、典型应用场景
- 仪表、面板指示灯、状态显示
- 背光、标识与商显点光源
- 消费电子与便携设备的指示与装饰照明
- 工业控制与通信设备的状态指示
五、设计与使用建议
- 建议驱动电流以 20 mA 为参考标定，视亮度需求可适当降低以延长寿命与降低发热。
- 选择限流电阻：R = (Vcc − Vf) / If，例如 5 V 系统、Vf 约 3.0 V、If = 20 mA 时，R ≈ 100 Ω。
- 热管理：尽管单颗功耗不高，但密集排布时应注意PCB散热与铜箔面积，避免长期高温运行。
- 焊接与贴装：建议采用标准回流焊工艺（遵循元件与PCB的温度曲线），并做好抗静电防护与湿度控制。
- 储存与搬运：保持干燥包装，避免长时间潮湿环境，防止焊接故障或光学性能变化。
六、选型注意与优势
XL-3210UGC 提供了在小尺寸条件下较高的光强与宽视角，透明透镜保证色温纯净、色彩还原良好；侧贴封装适合边缘或侧面指示需求。选型时应综合考虑系统电压、期望亮度及工作环境温度，必要时与供应商确认峰值波长与光学测试条件。
如需更详细的电气曲线、光度分布图或封装二维图，请索取产品数据手册（PDF）以便工程开发与可靠性评估。
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