WMSIC Electronic Components

Xinglight XL-1606UBC LED XL-1606UBC

ModelXL-1606UBC
PackageSMD,1.7x1.1mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1606UBC
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1606UBC
Electronic Component
1
Package
SMD,1.7x1.1mm
Electronic Component
460nm~475nm
Electronic Component
LEDDiode / LED
Electronic Component
0.021g
Electronic Component
1
LED
260mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0226465759
Electronic Component
465nm
Operating Temperature
20℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1606UBC(Xinglight 成兴光)产品概述

一、产品简介

XL-1606UBC 是成兴光(Xinglight)推出的一款高亮度蓝色贴片发光二极管(LED),采用小尺寸 SMD 封装(1.1 × 1.7 mm),为空间受限、要求侧向出光或面光效果的电子产品提供稳定的指示与照明解决方案。该器件以蓝色主峰波长 465 nm 为中心,光通性能和封装密度兼顾,适合消费电子、背光指示与信号指示等应用。

二、主要参数(典型值)

  • 型号:XL-1606UBC
  • 品牌:Xinglight(成兴光)
  • 封装:SMD,尺寸 1.1 × 1.7 mm(相当于微型 0602 类别)
  • 发光颜色:蓝色
  • 峰值波长:465 nm
  • 波长范围:460 – 475 nm
  • 正向电流(If):20 mA(典型驱动值)
  • 正向压降(Vf):2.4 V(在 If = 20 mA 时典型)
  • 发光强度:260 mcd(在标准测试条件)
  • 发光角度:120°(半值角,广角发散)
  • 光功率:70 mW(标注数值,请按厂方光电数据表为准)
  • 透镜颜色:无色透明透镜
  • 载带方式:侧贴(便于贴片机取放)

三、光学特性与表现

XL-1606UBC 的大视角(≈120°)意味着出光分布较宽,适用于均匀照明或指示灯应用,而非需要窄束或高亮点聚焦的场合。峰值 465 nm 的蓝光在视觉上具有良好的辨识度,与常见荧光材料或光学滤光片配合时可实现明亮的色彩呈现。标称发光强度 260 mcd(在 20 mA)可满足指示灯、面板信号及小型背光的常见亮度需求。

四、电气特性与驱动建议

  • 推荐工作电流:20 mA(产品标称值),可作为一般设计驱动电流。若需延长寿命或降低发热,可采用 10–15 mA 的降额驱动。
  • 驱动方式:建议使用恒流驱动器或在串联电阻的恒压供电下限制电流。
    • 示例:在 5 V 供电时,串联电阻 R ≈ (5.0 − 2.4) / 0.02 ≈ 130 Ω(实际取值 120 Ω 或 150 Ω,并按功率余量选择电阻功率)。
  • 功耗与散热:器件正向电功率约为 If × Vf ≈ 0.02 A × 2.4 V = 48 mW。尽管单个器件热量较低,但在高密度排列或高环境温度下仍需考虑 PCB 热阻与热沉设计。
  • 反向电压/静电保护:LED 为低压半导体器件,应避免反向电压过高与静电冲击,电路设计中加入反向保护二极管或限流措施可提高可靠性。

五、封装与安装建议

  • 尺寸小巧,适合高密度 PCB 布局。根据封装尺寸建议合理设计焊盘,保证可焊性与贴装精度。
  • 贴装方式:支持常规回流焊工艺。为保证焊接质量,推荐遵循焊膏量与回流曲线的最佳实践,并参照供应商提供的焊接说明。
  • 载带为侧贴设计,与贴片机兼容性良好;在贴装前应确认元件取放方向与光学朝向满足产品要求。

六、典型应用场景

  • 面板与仪表指示灯
  • 消费电子状态指示(如耳机、音响、遥控器)
  • 小型背光与符号标识
  • 医疗设备、工业控制面板的信号显示

七、使用注意事项与可靠性建议

  • 在高湿或有腐蚀性气体的环境中应做防护处理,避免镀层或透镜受损。
  • 长期高电流驱动会加速衰减,若对亮度一致性和寿命有较高要求,建议采用降额驱动并进行寿命验证。
  • 设计中加入 ESD 保护元件和合适的热管理方案,有助于提高产品稳定性。
  • 在批量导入前,建议通过样品测试验证在目标 PCB、驱动方式与环境下的光电性能与可靠性。

八、选型与采购参考

XL-1606UBC 以其微小封装与较宽发光角度,适合对空间与视角有双重要求的产品设计。选型时请参照成兴光正式数据表核实额定值、光电曲线与包装信息,如需配套色坐标、光谱分布或焊接曲线等资料,可向供应商索取详细数据表与可靠性测试报告。

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