WMSIC Electronic Components

Xinglight XL-2835HIR-T202 LED XL-2835HIR-T202

ModelXL-2835HIR-T202
PackageSMD2835-2P
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-2835HIR-T202
Type
XINGLIGHT
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-2835HIR-T202
Electronic Component
1
Package
SMD2835-2P
Electronic Component
840nm~870nm
Electronic Component
Infrared Emitter
Electronic Component
120°
Electronic Component
0.039g
Electronic Component
35nm
Electronic Component
1
Electronic Component
BM0259344269
Operating Temperature
40℃~+85℃
Current
100mA
Electronic Component
30mW/sr
(Vf)
1.4V~2.1V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

贴片红外发光二极管XL-2835HIR-T202产品概述

XL-2835HIR-T202是成兴光(Xinglight)针对光电感应、红外补光等场景推出的SMD2835封装近红外发光二极管,凭借宽温工作、宽视角、稳定可靠的特性,成为工业自动化、智能家居、安防监控等领域的常用光源器件。

一、产品基本信息

该器件由成兴光(Xinglight)研发生产,型号为XL-2835HIR-T202,采用行业标准SMD2835表面贴装封装,属于近红外发光二极管(输出光为人眼不可见的近红外光)。其核心定位是中距离感应、广域覆盖的红外光源,适配多种小型化电子设备的集成需求,无需额外复杂光学设计即可实现高效感应。

二、核心电性能参数

电性能是决定器件适用场景的关键,XL-2835HIR-T202的核心电参数如下:

  • 正向压降(Vf):1.4V~2.1V,不同工作电流下的压降范围(典型值约1.8V),需匹配驱动电路的输出电压以保证稳定工作,避免压降波动影响感应精度;
  • 耗散功率(Pd):150mW,为器件最大允许功率,工作时需严格控制功率不超过此值,避免芯片过热导致性能衰减;
  • 额定正向电流(If):100mA,连续工作时的推荐电流,脉冲工作模式下峰值电流可适当提高但需控制时间(通常≤200mA,脉冲宽度≤1ms);
  • 直流反向耐压(Vr):5V,反向电压的最大限制,超过可能导致器件反向击穿,需在电路中增加反向保护(如并联1N4148二极管);
  • 工作温度范围:-40℃~+85℃,宽温设计可适应户外低温、工业高温等复杂环境,满足极端场景下的长期稳定工作需求。

三、光学特性分析

光学特性决定了器件的感应距离、覆盖范围等核心性能:

  • 峰值波长:840nm~870nm,属于近红外区域(人眼不可见),适合隐蔽式应用(如监控补光、人体感应),且与多数光电接收器的响应波长匹配,无需额外滤波即可高效检测;
  • 辐射强度:30mW/sr,单位立体角内的辐射功率,可有效覆盖3~5米左右的感应距离,满足常规场景的检测需求(如楼道人体感应、自动门物体检测);
  • 视角:120°,宽发光角度可覆盖大面积区域,无需多灯珠即可实现广域感应,降低系统成本与设计复杂度;
  • 半波宽:35nm,光谱带宽适中,既保证足够的发光效率,又减少对其他波长光源的干扰,提升感应精度(避免误触发)。

四、封装与可靠性优势

SMD2835封装为器件带来多方面优势:

  • 小型化集成:尺寸符合行业标准(适配自动化贴装设备),可集成到紧凑的电子模块中(如智能开关、小型传感器),节省PCB空间;
  • 可靠性设计:宽温工作范围支持极端环境应用;反向耐压5V、耗散功率150mW的参数设计,能承受常规电压电流波动,长期工作稳定性好(平均无故障时间可达10万小时以上);
  • 散热性能:贴片封装通过PCB铜箔散热,配合合理的电路设计(如限流电阻),可有效控制芯片温度,避免热失效(若长时间大电流工作,建议在PCB上增加散热铜箔)。

五、典型应用场景

基于其电性能与光学特性,XL-2835HIR-T202广泛应用于以下场景:

  1. 人体感应模块:楼道灯、智能开关、安防探测器等,通过红外反射检测人体存在,实现自动控制(如人来灯亮、人走灯灭);
  2. 物体检测系统:自动门、收银台商品检测、工业流水线位置感应,利用红外透射/反射原理检测物体(如自动门感应行人、流水线计数);
  3. 红外补光设备:安防监控摄像头、夜视仪补光,人眼不可见且提升夜间成像清晰度(不影响环境视觉体验);
  4. 光电开关:工业自动化中的位置检测、计数设备,配合光电接收器实现精准感应(如机械臂位置定位);
  5. 中距离遥控器:部分智能家居、玩具遥控器,850nm左右波长匹配常见光电接收器,实现稳定信号传输。

六、使用注意事项

为保证器件长期稳定工作,需注意以下事项:

  1. 电流控制:连续工作时正向电流不超过100mA,脉冲模式下峰值电流≤200mA(脉冲宽度≤1ms),避免过流损坏;
  2. 反向保护:避免施加超过5V的反向电压,可并联反向二极管(如1N4148)防止反向击穿;
  3. 焊接规范:焊接温度≤260℃,焊接时间≤3秒,避免高温损坏芯片(建议采用回流焊工艺);
  4. 散热设计:长时间大电流工作时,需在PCB上增加散热铜箔,或降低工作电流(如70~80mA),控制芯片温度≤85℃;
  5. 存储条件:存储于常温干燥环境(温度-20℃~+60℃,湿度≤60%),避免阳光直射和潮湿,开封后建议1个月内使用完毕。

XL-2835HIR-T202凭借平衡的电性能与光学特性,成为多种光电感应场景的高性价比选择,可满足不同行业的常规应用需求。

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