WMSIC Electronic Components

Xinglight XL-2012SURC-FJ LED XL-2012SURC-FJ

ModelXL-2012SURC-FJ
Package805
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-2012SURC-FJ
Type
XINGLIGHT
Minimum package
3000 圆盘

Technical parameters

Power
60mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-2012SURC-FJ
Electronic Component
1
Package
805
Electronic Component
618nm~630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.024g
Electronic Component
1
LED
600mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0230032123
Electronic Component
625nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-2012SURC-FJ(0805)产品概述

一、产品简介

XL-2012SURC-FJ 是 Xinglight(成兴光)推出的一款红色贴片发光二极管,封装规格为0805(2012英制尺寸)。器件采用无色透明透镜,发光颜色为红色,峰值波长625nm(波长范围618–630nm),视角宽达120°,面向高可靠性和通用指示/背光类应用设计。

二、主要电光参数

  • 发光颜色:红色
  • 峰值波长:625nm(波长范围 618–630nm)
  • 正向电压 (Vf):1.9V ~ 2.3V
  • 额定正向电流:20mA(典型驱动值)
  • 功率:60mW(器件耗散限值,请按功率/电流限制使用)
  • 发光强度:约600mcd(典型)
  • 发光角度:120°(广角透镜)
  • 封装:0805 贴片(载带方式:正贴)
  • 工作温度范围:-40°C ~ +85°C

三、产品特点与优势

  1. 高亮度、小体积:0805小尺寸适合高密度PCB布局,同时提供约600mcd的视觉亮度,适合状态指示。
  2. 宽视角设计:120°大角度覆盖,光分布均匀,便于指示可视性。
  3. 宽温度适用:-40°C 到 +85°C 的工作温度,适合多数民用及工业环境。
  4. 无色透明透镜:颜色纯净,色温和色点一致性好,适合对色彩有要求的显示应用。
  5. 兼容自动化贴装:正贴载带适用于高速贴片机和回流焊工艺。

四、典型应用场景

  • 面板/设备状态指示灯
  • 通讯与网络设备指示
  • 家电与消费电子指示/背光
  • 仪表盘与控制器状态显示
  • 指示列阵与标识系统

五、使用与设计建议

  1. 驱动与限流:推荐使用恒流源驱动。若使用串联限流电阻,以5V供电、取Vf典型2.1V、If=20mA为例:R=(5V−2.1V)/0.02A≈145Ω,建议取150Ω;3.3V供电时R≈(3.3−2.1)/0.02≈60Ω,建议取68Ω。考虑Vf范围(1.9–2.3V)与容差,限流元件应留有余量。
  2. 功率与热管理:器件额定功率约60mW,长时间在高If下工作会升高结温,建议在高环境温度或密集布板时适当降低平均电流或采用脉宽调制(PWM)调光以降低热应力。
  3. 焊接与回流:兼容常规无铅回流焊工艺。遵循J-STD 推荐的回流曲线(峰值温度与时间限制),避免长时间高温暴露以保护光效与可靠性。
  4. 焊盘与贴装:采用标准0805焊盘并保证焊膏量可形成良好焊点,建议在PCB布局时留足空间以便散热与检修。
  5. 静电防护:为防止ESD损伤,生产与安装过程应采取静电防护措施。

六、检测与可靠性

建议在设计验证阶段进行光通量、颜色坐标、正向电压随温度变化的测试,验证在最大工作温度与长期驱动下的光输出衰减。对批量生产建议做来料光电参数抽检以确保一致性。

七、包装与订购信息

产品为0805封装,采用正贴载带包装,适配高速贴片机直接上料。购买或批量使用前,请确认对应的极性标识和卷带物料编号,以便正确贴装。

如需更详细的封装尺寸图、焊盘建议、回流曲线或极性标识图,请提供进一步需求,我可依据官方数据表为您补充精确设计资料与应用示例。

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