WMSIC Electronic Components

Xinglight XL-1608SURC-06FJ LED XL-1608SURC-06FJ

ModelXL-1608SURC-06FJ
Package603
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608SURC-06FJ
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608SURC-06FJ
Electronic Component
1
Package
603
Electronic Component
618nm~630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.02g
Electronic Component
1
LED
600mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0225275831
Electronic Component
625nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608SURC-06FJ(0603)贴片发光二极管 — 产品概述

一、产品简介

XL-1608SURC-06FJ 是成兴光(Xinglight)推出的一款高亮度 0603 贴片红色发光二极管。器件采用正贴(SMD)封装、无色透明透镜,峰值波长 625nm,视角 120°,在标准驱动条件下可提供约 600mcd 的发光强度,适用于对体积和亮度均有要求的各类指示与背光场景。

二、主要参数

  • 型号:XL-1608SURC-06FJ
  • 封装:0603(1608公制)正贴
  • 发光颜色:红色
  • 峰值波长:625 nm(典型)
  • 波长范围:618 nm ~ 630 nm
  • 正向电流(If):20 mA(最大工作电流)
  • 正向电压(Vf):1.8 V ~ 2.3 V
  • 发光强度:600 mcd(典型)
  • 发光角度:120°(典型)
  • 功率耗散:50 mW
  • 工作温度:-40 ℃ ~ +85 ℃
  • 透镜颜色:无色透明透镜
  • 载带方式:正贴(SMD)

三、主要特性

  • 高亮度、色彩纯正:峰值 625nm,色温稳定,适合做明显指示灯或强调色显示。
  • 宽视角:120°的大视角有利于宽范围可视。
  • 小体积封装:0603 封装便于高密度贴装,适合便携、消费电子类产品。
  • 宽温区运行:-40 ~ +85℃,适应多种环境应用。

四、电气与光学应用提示

  • 驱动与限流:建议使用限流电阻或恒流源驱动,建议工作电流不超过 20 mA。例:在 5 V 电源下,选择限流电阻 R = (5 V − Vf)/If。以 Vf 典型值 2.0 V、If 20 mA,R ≈ 150 Ω;所选电阻额定功率建议 ≥ 0.25 W 以保证余量。
  • 功率与散热:器件最大功率 50 mW,在高占空比或连续点亮时注意电流与功率分配,必要时采用降额工作(例如常用 10–15 mA)以延长寿命。
  • 反向电压与ESD:尽量避免反向高压与静电冲击,装配和调试过程中做好静电防护,具体反向极限请以完整数据手册为准。
  • 光学布局:透明透镜与大视角适合面向用户的指示灯设计,如需聚焦或遮光请配套机械结构调整。

五、封装、焊接与贴装建议

  • 0603 小型封装,推荐参考厂家推荐的焊盘尺寸与回流焊曲线进行 PCB 设计与制程控制。
  • 本型号通常兼容无铅回流工艺,建议在回流峰值温度与时间上遵循供应商的回流曲线以避免光衰或封装损伤。
  • 贴装时注意极性标识与方向控制,贴片后尽量减少机械应力与重工次数。

六、典型应用

  • 面板与设备指示灯(电源、状态、告警)
  • 消费电子按键背光与指示
  • 仪器仪表、医疗设备的状态提示
  • 交通与标识小型指示组件

七、选型与使用注意事项

  • 在高温或高湿环境中长期使用应考虑光衰与老化,必要时选用降额驱动或增加散热设计。
  • 如需严格光强一致性或颜色一致性,建议在同一批次中配对使用并根据厂家提供的 BIN 分级选择。
  • 在电路设计时预留合适限流与保护元件,避免短时过流或反向高压造成器件损坏。
  • 对于特定外形、标识或机械固定方式的要求,请参照成兴光的完整产品数据手册或联系厂家获取推荐封装图与贴装模板。

如需完整电气/光学曲线、回流焊建议曲线、尺 寸图或 BIN 分级表,请告知,我可帮您提取并整理成便于工程使用的技术资料。

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